{"id":"W4416883630","doi":"10.37665/ppjxvqa25605","title":"C4NP: Lead-Free and Low Cost Solder Bumping Technology for Flip Chip and Wlcsp","year":2006,"lang":"","type":"article","venue":"Pan Pacific Symposium","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"ca_institutions":"Microsemi (Canada)","funders":"","keywords":"Bumping; Soldering; Flip chip; Chip-scale package; Wafer; Solder paste","routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false,"invisible_to_affiliation_only":false},"retraction":null,"screen":null,"direct_labels":[],"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0004102296,0.0007823789,0.0008285134,0.0006751912,0.0005463468,0.0002892483,0.0005817635,0.0009349127,0.000004205342],"category_scores_gemma":[0.0001646918,0.0008700828,0.0001311083,0.000548102,0.0007369046,0.0001855124,0.0003687845,0.0008348112,0.00001347717],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0002240751,"about_ca_system_score_gemma":0.00007201124,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0000548213,"about_ca_topic_score_gemma":0.00004856835,"domain_scores_codex":[0.9963204,0.00003610685,0.0006700879,0.001056185,0.0002219313,0.001695288],"domain_scores_gemma":[0.998125,0.0002768475,0.0001591105,0.001240402,0.00008015994,0.000118492],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"bench_or_experimental","study_design_scores_codex":[0.0001637644,0.0004285241,0.02279854,0.004255048,0.0008576091,0.00007937715,0.002071491,0.001795689,0.7597973,0.06539031,0.01708058,0.1252818],"study_design_scores_gemma":[0.01554534,0.001955717,0.005637389,0.003936615,0.001210069,0.001322164,0.008688411,0.2325072,0.5331568,0.1144308,0.07331164,0.008297852],"study_design_candidate":"bench_or_experimental","study_design_consensus":"bench_or_experimental","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.8421058,0.05678828,0.04693853,0.02038176,0.002657544,0.004343133,0.0003374571,0.00810265,0.01834485],"genre_scores_gemma":[0.9920198,0.003312417,0.002516867,0.00002163925,0.0003026224,0.0003030371,0.00002429542,0.0001738929,0.001325472],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.2307115,"threshold_uncertainty_score":0.999375,"prediction_status":"machine_predicted_unvalidated"},"machine_scores":{"provisional":true,"baseline":true,"maturity_gate_passed":false,"score_opus":0.007130211700205046,"score_gpt":0.2050544867910382,"score_spread":0.1979242750908332,"validation_status":"score_only:v0-immature-baseline","note":"Baseline scores from an immature model (maturity gate not passed). Scores rank; they never assert a category."}}