{"id":"W4416884140","doi":"10.37665/watgndh53502","title":"Lead Free Bumping Using C4Np Reliability and Cost Information-Extended Abstract-","year":2005,"lang":"","type":"article","venue":"Wafer-Level Packaging Symposium","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"ca_institutions":"Microsemi (Canada)","funders":"","keywords":"Bumping; Soldering; Wafer; Chip-scale package; IBM; Solder paste","routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false,"invisible_to_affiliation_only":false},"retraction":null,"screen":null,"direct_labels":[],"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.001323649,0.001170131,0.001030694,0.0007082569,0.0009043728,0.0007983817,0.001176692,0.0008197838,0.00004969192],"category_scores_gemma":[0.0005831961,0.001349375,0.0002633879,0.0007131476,0.000537456,0.002538826,0.0007380822,0.002073731,0.0001524431],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.001584984,"about_ca_system_score_gemma":0.0003390172,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0003466256,"about_ca_topic_score_gemma":0.00007364054,"domain_scores_codex":[0.9943408,0.00008378972,0.001643785,0.0009762491,0.0007468804,0.002208455],"domain_scores_gemma":[0.9963788,0.0003288203,0.0004237556,0.002259135,0.0002520883,0.0003573838],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"simulation_or_modeling","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.0002267663,0.0006908268,0.008748511,0.00569238,0.001416089,0.00007000149,0.01811187,0.5394843,0.158302,0.01203521,0.009757086,0.2454649],"study_design_scores_gemma":[0.004870444,0.0002162793,0.01601353,0.002344263,0.0005145648,0.0003857208,0.002077092,0.8550642,0.05934122,0.003724082,0.05111327,0.004335401],"study_design_candidate":"simulation_or_modeling","study_design_consensus":"simulation_or_modeling","genre_codex":"empirical","genre_gemma":"empirical","genre_scores_codex":[0.9100354,0.005554904,0.04535278,0.01334064,0.002444054,0.002003628,0.0004317524,0.005018669,0.01581821],"genre_scores_gemma":[0.9795377,0.001359075,0.01781022,0.0002448891,0.0004398189,0.0000514343,0.00004200117,0.0001565438,0.000358323],"genre_candidate":"empirical","genre_consensus":"empirical","teacher_disagreement_score":0.3155798,"threshold_uncertainty_score":0.9988956,"prediction_status":"machine_predicted_unvalidated"},"machine_scores":{"provisional":true,"baseline":true,"maturity_gate_passed":false,"score_opus":0.0243614635655656,"score_gpt":0.2489594498571481,"score_spread":0.2245979862915825,"validation_status":"score_only:v0-immature-baseline","note":"Baseline scores from an immature model (maturity gate not passed). Scores rank; they never assert a category."}}