{"id":"W4416884270","doi":"10.37665/wagvgjd10067","title":"C4NP - Data for Fine Pitch to CSP Flip Chip Solder Bumping","year":2006,"lang":"","type":"article","venue":"Wafer-Level Packaging Symposium","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"ca_institutions":"IBM (Canada)","funders":"","keywords":"Bumping; Soldering; Flip chip; Chip-scale package; Solder paste; Wafer; Microelectronics; Wafer-level packaging; Integrated circuit packaging","routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":true,"invisible_to_affiliation_only":false},"retraction":null,"screen":null,"direct_labels":[],"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":["metaepi_narrow"],"category_scores_codex":[0.001544564,0.001641902,0.001516657,0.0009286585,0.001002956,0.000793831,0.00376239,0.0008299989,0.00004805554],"category_scores_gemma":[0.0004448345,0.001885549,0.0003887764,0.001311333,0.000234547,0.0007229055,0.001740721,0.001459621,0.0002656119],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0008630161,"about_ca_system_score_gemma":0.0003718801,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0005863221,"about_ca_topic_score_gemma":0.0003482638,"domain_scores_codex":[0.990995,0.0001066688,0.001665879,0.002576372,0.0008231003,0.003833004],"domain_scores_gemma":[0.9931794,0.0005551125,0.0003032341,0.005316716,0.0002340072,0.0004115127],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"bench_or_experimental","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.0002573604,0.0009222301,0.005529094,0.003793841,0.00164816,0.000131831,0.002252087,0.1445291,0.4989554,0.02741856,0.2795769,0.03498534],"study_design_scores_gemma":[0.007344987,0.001002565,0.007184886,0.004633067,0.001344999,0.0002484763,0.0007074737,0.424226,0.2111911,0.01068655,0.3221098,0.009320023],"study_design_candidate":"bench_or_experimental","study_design_consensus":null,"genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.28818,0.01213248,0.6007443,0.0518432,0.01062177,0.006241796,0.004586044,0.01234296,0.01330745],"genre_scores_gemma":[0.9647594,0.0002525241,0.02486758,0.00032183,0.002164042,0.000294346,0.0008830763,0.000586481,0.005870739],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.6765794,"threshold_uncertainty_score":0.9996328,"prediction_status":"machine_predicted_unvalidated"},"machine_scores":{"provisional":true,"baseline":true,"maturity_gate_passed":false,"score_opus":0.05048092656623807,"score_gpt":0.272186284909809,"score_spread":0.2217053583435709,"validation_status":"score_only:v0-immature-baseline","note":"Baseline scores from an immature model (maturity gate not passed). Scores rank; they never assert a category."}}