{"id":"W7108220634","doi":"10.37665/smarkbe94437","title":"Via-in-Pad Design Considerations for Bottom Terminated Components on Printed Circuit Board Assemblies","year":2014,"lang":"","type":"article","venue":"SMTA International","topic":"Electronic Packaging and Soldering Technologies","field":"Engineering","cited_by":0,"is_retracted":false,"has_abstract":true,"ca_institutions":"IBM (Canada)","funders":"","keywords":"Rework; Printed circuit board; Footprint; Surface-mount technology; Quad Flat No-leads package; Design for manufacturability; Component (thermodynamics); Soldering; Electronic component; Reliability (semiconductor)","routes":{"ca_aff":true,"ca_fund":false,"ca_venue":false,"about_ca":false,"invisible_to_affiliation_only":false},"retraction":null,"screen":null,"direct_labels":[],"prediction":{"model_version":"codex-gemma-dda1882f352a","candidate_categories":["metaepi_narrow"],"consensus_categories":[],"category_scores_codex":[0.0006930282,0.0003979669,0.0003996088,0.0006350353,0.0001703212,0.0002128112,0.0005076961,0.0002970218,0.00008971169],"category_scores_gemma":[0.001309735,0.000458154,0.000143109,0.0001725268,0.0001103938,0.0001899691,0.00008771649,0.0006772414,0.00007316549],"about_ca_system_candidate":false,"about_ca_system_consensus":false,"about_ca_system_score_codex":0.0005625068,"about_ca_system_score_gemma":0.00007774603,"about_ca_topic_candidate":false,"about_ca_topic_consensus":false,"about_ca_topic_score_codex":0.0000488019,"about_ca_topic_score_gemma":0.00003410955,"domain_scores_codex":[0.9977382,0.0001272037,0.0006213621,0.0005319788,0.000357849,0.0006234387],"domain_scores_gemma":[0.9976981,0.001470662,0.0001429398,0.0004366069,0.0001795049,0.00007213726],"domain_codex":null,"domain_gemma":null,"domain_candidate":null,"domain_consensus":null,"study_design_codex":"theoretical_or_conceptual","study_design_gemma":"simulation_or_modeling","study_design_scores_codex":[0.0005974695,0.001868501,0.0124943,0.0004643821,0.002442445,0.0001042794,0.002228594,0.225436,0.2331277,0.4654548,0.01397871,0.04180282],"study_design_scores_gemma":[0.002428276,0.0004114486,0.01172274,0.0005444539,0.00004308399,0.00003376845,0.00004658226,0.8443911,0.04968069,0.08581106,0.004162995,0.0007238011],"study_design_candidate":"simulation_or_modeling","study_design_consensus":null,"genre_codex":"methods","genre_gemma":"empirical","genre_scores_codex":[0.2936818,0.0001413461,0.6934234,0.003283612,0.002978791,0.001007097,0.00006192824,0.001107619,0.004314446],"genre_scores_gemma":[0.9893619,0.00005502966,0.009600858,0.0001375514,0.0001578918,0.0002075387,0.00004801094,0.00006797854,0.0003631984],"genre_candidate":"empirical","genre_consensus":null,"teacher_disagreement_score":0.6956801,"threshold_uncertainty_score":0.999787,"prediction_status":"machine_predicted_unvalidated"},"machine_scores":{"provisional":true,"baseline":true,"maturity_gate_passed":false,"score_opus":0.05142165451517149,"score_gpt":0.272149592792862,"score_spread":0.2207279382776905,"validation_status":"score_only:v0-immature-baseline","note":"Baseline scores from an immature model (maturity gate not passed). Scores rank; they never assert a category."}}