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4,299,418 works, Canadian by any of four routes.

Every filter state is a URL; the URL is the query; the query is citable via /q/⟨hash⟩. The page, the API and the export parse the same parameters.

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The current cohort, streamed from the database: every work column, the machine labels, the provisional scores, and the per-row validation status. Exports are capped at 100,000 rows. Mints a permanent /q/ link for this exact query. The same filters always produce the same link, whoever asks.

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Journal of Electronic Materials
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Direct Codex and Gemma labels are unvalidated and sparse. Distilled predictions cover the full frame and are also unvalidated. Choose the evidence source explicitly; absence of a direct label is never a negative label.

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The four routes compose: require the funder route and exclude affiliation to get the funder-only stratum no affiliation-based frame ever sees.

147 results · 1 filter active ·
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20002025
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Machine labels · sparse coverage
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An unlabeled work is unknown, not a negative. Label coverage is reported on every query.
147 works in the cohort · of 4,299,418page 1 of 3

Labels cover 0 of 147 works in this cohort. The rest are unlabeled, which is not a negative label: the label table is sparse today and grows as labeling rounds land.

Distilled predictions cover 147 of 147 works in this cohort. Predictions are machine_predicted_unvalidated teacher distillation outputs. Candidate is the union; consensus is the intersection.

affno abstractunlabeled
Microstructural characterization of inlaid copper interconnect lines
Paul R. Besser, Ehrenfried Zschech, Werner Blum, Delrose Winter, Richard Ortega, Stewart Rose +11 more
2001· article· en· Journal of Electronic Materials· Materials Science
distilled prediction:candidate · insufficient_payloadconsensus · none
70
citations
afffundno abstractunlabeled
Creep phenomena in lead-free solders
V. I. Igoshev, Jacob I. Kleiman
2000· article· en· Journal of Electronic Materials· Engineering
distilled prediction:candidate · noneconsensus · none
50
citations
affunlabeled
Nanocopper Based Solder-Free Electronic Assembly
K. Schnabl, Luke Wentlent, K. Mootoo, S. Khasawneh, Alfred A. Zinn, J. Beddow +3 more
2014· article· en· Journal of Electronic Materials· Materials Science
distilled prediction:candidate · insufficient_payloadconsensus · none
33
citations
affno abstractunlabeled
Elemental Compositions of Over 80 Cell Phones
Beverley Christian, Alexandre Romanov, I. P. Romanova, Laura J. Turbini
2014· article· en· Journal of Electronic Materials· Chemistry
distilled prediction:candidate · insufficient_payloadconsensus · none
29
citations
afffundno abstractunlabeled
The role of lattice mismatch in the deposition of CdTe thin films
Svetlana Neretina, Q. Zhang, Robert A. Hughes, James F. Britten, N.V. Sochinskii, J. S. Prestón +1 more
2006· article· en· Journal of Electronic Materials· Engineering
distilled prediction:candidate · noneconsensus · none
29
citations
affno abstractunlabeled
Femtosecond Laser Drilling of Alumina Wafers
Chengde Li, Seongkuk Lee, Suwas Nikumb
2009· article· en· Journal of Electronic Materials· Engineering
distilled prediction:candidate · noneconsensus · none
26
citations
affno abstractunlabeled
Fracture of Sn-3.5%Ag solder alloy under creep
V. I. Igoshev, Jacob I. Kleiman, Dongkai Shangguan, S. Wong, U. Michon
2000· article· en· Journal of Electronic Materials· Engineering
distilled prediction:candidate · insufficient_payloadconsensus · none
21
citations
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