Thin silicon wafer dicing with a dual-focused laser beam
Bibliographic record
Abstract
Driven by the ever-growing desire for more compact electronic devices, the semiconductor industry has moved toward thinner silicon wafers. Simultaneously, the semiconductor industry has introduced new and better materials to facilitate the size shrinking. These factors introduce serious limitation in current saw blade semiconductor wafer dicing technology and needs new processing tools. Although nanosecond laser dicing overcomes most of the issues related to saw blade dicing, the dicing throughput remains below the current industrial requirement. In this paper a novel dual focus mechanism is introduced to increase the throughput of laser wafer dicing. Experimental results proved that dual focus increases the dicing speed, reduces the kerf width, eliminates the debris and enhances the die fracture strength. Cutting strategy and laser parameters, such as back focus power, repetition rate and wavelength, that influence the machining efficiency and quality, were studied in detail. The industrial implement of laser singulation is discussed.
Fetched live from OpenAlex and de-inverted. Abstracts are not stored in this database: the inverted indexes are 8.6 GB of the frame’s 9.3 GB of text, and the host has 13 GB free.
How this classification was reachedexpand
Full frame machine prediction
Teacher imitationNot calibrated prevalence, not ground truth. Human validation pending. The Gemma side is a direct model label for every work in the frame, read from the title-only record. The Codex side is a classifier learned from the 10,348 direct Codex labels and calibrated to design-weighted sample rates; fields without enough sample support carry no Codex call. Candidate is the union of the two sides; consensus is their intersection. These outputs are machine_predicted_unvalidated and are not human labels.
Distilled classifier scores by category (both heads)
| Category | Codex | Gemma |
|---|---|---|
| Metaresearch | 0.000 | 0.000 |
| Meta-epidemiology (narrow) | 0.000 | 0.001 |
| Meta-epidemiology (broad) | 0.000 | 0.000 |
| Bibliometrics | 0.001 | 0.000 |
| Science and technology studies | 0.000 | 0.000 |
| Scholarly communication | 0.000 | 0.000 |
| Open science | 0.001 | 0.001 |
| Research integrity | 0.001 | 0.001 |
| Insufficient payload (model declined to judge) | 0.001 | 0.000 |
Machine scores (provisional)
The two teacher heads of the student model, read on this work. A score orders the frame for review; it never asserts a category, and the validation status ships verbatim with every row.
Baseline scores from an immature model (maturity gate not passed, 7 training rounds). Scores rank; they never assert a category.
score_only:v0-immature-baseline · verbatim from the scoring run: score_only means the number may rank works, and no category label ships from itClassification
machine, unvalidatedMachine predicted; a candidate call from one source (direct Gemma or distilled Codex), not a consensus.
How this classification was reached, model by model and score by score, is at the end of the page under "How this classification was reached".