The Influence of Solder Void Location on BGA Thermal Fatigue Life
Why this work is in the frame
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Bibliographic record
Abstract
ABSTRACT This paper addresses the effect of solder process voiding on the board level, thermal fatigue reliability of a large body 680 I/O plastic ball grid array (PBGA). The study is a subset of a much larger ongoing investigation of Pb-free reliability using the PBGA package as the primary test vehicle. Different assembly process parameters were used to generate localized voiding at either the package or the printed circuit board side of the solder joints. The fatigue performance was measured using accelerated temperature cycling with a 0°C to 100°C thermal cycle. Baseline microstructural analysis and post-cycling failure analysis was conducted on representative test samples from each cell. Voiding was characterized using optical metallographic techniques. The fundamental conclusion of the investigation is that process voiding can reduce the interconnect fatigue reliability but that void location, not void size or volume fraction, has the greatest influence on fatigue life.
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Full frame distilled prediction
Teacher imitationNot calibrated prevalence, not ground truth. Human validation pending. Learned from the 10,348 direct Codex labels and 10,348 direct Gemma labels. Candidate is the union of thresholded teacher heads; consensus is their intersection. These outputs are machine_predicted_unvalidated and are not human labels or direct frontier model labels.
Codex and Gemma teacher scores by category
| Category | Codex | Gemma |
|---|---|---|
| Metaresearch | 0.000 | 0.001 |
| Meta-epidemiology (narrow) | 0.000 | 0.000 |
| Meta-epidemiology (broad) | 0.000 | 0.000 |
| Bibliometrics | 0.000 | 0.000 |
| Science and technology studies | 0.000 | 0.000 |
| Scholarly communication | 0.000 | 0.000 |
| Open science | 0.001 | 0.000 |
| Research integrity | 0.000 | 0.001 |
| Insufficient payload (model declined to judge) | 0.000 | 0.000 |
Machine scores (provisional)
The two teacher heads of the student model, read on this work. A score orders the frame for review; it never asserts a category, and the validation status ships verbatim with every row.
Baseline scores from an immature model (maturity gate not passed, 7 training rounds). Scores rank; they never assert a category.
score_only:v0-immature-baseline · verbatim from the scoring run: score_only means the number may rank works, and no category label ships from it