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Record W7125814242 · doi:10.4071/001c.147811

Heterogenous Integration in High Volume: Now and Looking Forward

2025· article· en· W7125814242 on OpenAlex

Why this work is in the frame

A frame that forgets how it found something cannot be audited. These are the routes that admitted this work.

affAt least one author lists a Canadian institution in the pinned OpenAlex snapshot.

Bibliographic record

VenueIMAPSource Proceedings · 2025
Typearticle
Languageen
FieldEngineering
Topic3D IC and TSV technologies
Canadian institutionsAdvanced Micro Devices (Canada)
Fundersnot available
KeywordsBandwidth (computing)DramIncentivePresentation (obstetrics)MirroringWorkstationChipGigabitVertical integration

Abstract

fetched live from OpenAlex

AMD is an industry leader in the use of advanced packaging to enhance its products. Over the past decade, this has included volume production of 2.5D technologies including silicon interposer, organic RDL interposer (FO-RDL), and embedded fan-out bridge (EFB); hybrid bond (SOIC) 3D logic-on-SRAM stacking, and cost-effective chiplet re-use with multi-chip modules. The recently released AMD Instinct MI300 AI chip sets a new standard for what can be achieved from heterogenous integration with 3.5D packaging 3D hybrid bond logic die stacks are connected together and to eight total eight- or twelve-high HBM DRAM stacks using a 2.5D silicon interposer, resulting in a module with massive compute capacity and the near memory capacity and bandwidth needed to support it.This presentation will begin with a brief review of the history of AMDs advanced packaging engagements and the technical incentives for investing in specific technologies. It will then transition into a deeper look at the AI-specific trends that resulted in 3.5D packaging technology. These include compute performance doubling faster than every two years, memory bandwidth doubling every two years, networking bandwidth doubling at only a slightly slower pace, and total power consumption continuing to rise. How heterogenous integration benefits each of these areas will be discussed, along with some of the challenges it introduces. The presentation will conclude with a look at how these trends scale into the future and where AMD is investing its efforts in next-generation technologies. Continuous improvement in 2.5D and 3D capabilities through pitch scaling, increased stacking height, and incorporation of additional features such as high density capacitors remains critical to meet next-generation targets. The evolution of silicon process will also factor into the way next-generation modules are designed, as AI workload power densities strain against the limits of what even advanced liquid cooled thermal solutions can support. The extremely large size of AI modules, their power consumption and growing off-package IO bandwidth requirements necessitate innovations in the rest of the packaging ecosystem as well, as SMT warpage, power delivery, and high-speed IO all have fundamental issues meeting current scaling trends. These challenges ensure there are many important problems for the advanced packaging community to solve in the decade to come.

Fetched live from OpenAlex and de-inverted. Abstracts are not stored in this database: the inverted indexes are 8.6 GB of the frame’s 9.3 GB of text, and the host has 13 GB free.

Full frame distilled prediction

Teacher imitation

Not calibrated prevalence, not ground truth. Human validation pending. Learned from the 10,348 direct Codex labels and 10,348 direct Gemma labels. Candidate is the union of thresholded teacher heads; consensus is their intersection. These outputs are machine_predicted_unvalidated and are not human labels or direct frontier model labels.

metaresearch head score (Codex)0.000
metaresearch head score (Gemma)0.000
Version: codex-gemma-dda1882f352aValidation status: machine_predicted_unvalidated
Candidate categoriesnone
Consensus categoriesnone
DomainCandidate signal: none · Consensus signal: none
Study designCandidate signal: Observational · Consensus signal: none
GenreCandidate signal: Empirical · Consensus signal: Empirical
Teacher disagreement score0.440
Threshold uncertainty score0.504

Codex and Gemma teacher scores by category

CategoryCodexGemma
Metaresearch0.0000.000
Meta-epidemiology (narrow)0.0000.000
Meta-epidemiology (broad)0.0000.000
Bibliometrics0.0000.000
Science and technology studies0.0000.000
Scholarly communication0.0000.000
Open science0.0000.000
Research integrity0.0000.000
Insufficient payload (model declined to judge)0.0000.000

Machine scores (provisional)

The two teacher heads of the student model, read on this work. A score orders the frame for review; it never asserts a category, and the validation status ships verbatim with every row.

Baseline scores from an immature model (maturity gate not passed, 7 training rounds). Scores rank; they never assert a category.

Opus teacher head0.003
GPT teacher head0.191
Teacher spread0.188 · how far apart the two teachers sit on this one work
Validation statusscore_only:v0-immature-baseline · verbatim from the scoring run: score_only means the number may rank works, and no category label ships from it