Improved Layout of Inverter for EMC Analysis

This paper details EMC (electromagnetic compatibility) analysis on an inverter application. The work deals with the whole power chain (±270Vdc input voltage to 3-phase 115 Vac output voltage). This inverter is composed by modular parts (power module and EMC filters) that supply motors in more electrical aircraft. Through our analysis an approach is defined to design a detailed lumped circuit model of the power module layout by using Q3D extractor and SABER software. From this first step, the power module layout design is improved by reduced parasitic impedances at high frequency (around 30 MHz). Then whole power converter is modeled in SABER by including switches (SiC MOSFET models), LISN (line impedance stabilization network), harness, and load models. I Introduction The more electrical aircraft aims to offer many benefits [1]. On the one hand, it reduces operating costs, fuel consumption and the environmental impact of the future air travel. On the other hand, the use of electrical equipment leads to advantages in terms of maintenance, power control and efficiency [2], [3]. Thanks to this concept, electrical systems should substitute conventional power sources used in aircraft. As a result, they take a significant part of the total aircraft mass. Among these systems, there are power electronic converters that control actuator energy. Different efforts are made in order to improve power electronic converter efficiency by considering new semiconductor technologies (GaN, SiC …). These efforts also allow to increase switching frequency and, operating temperature in the way to reduce passive components and cooling requirements. Within the scope of the EU research and innovation program Horizon2020 [4], the I 2 MPECT project [5] aims to bridge this gap and create synergies for the aircraft industry with other industries. The goals of the I 2 MPECT project are the following:  Increase efficiency, power density of power electronic conversion systems through the use of wide band gap devices and innovative cooling technology.  Increase reliability and efficiency by use of advanced packaging and thermal management solutions.  Enable reduced maintenance cost and increase availability by employing health-monitoring techniques.  Reduce qualification and certification cost through the availability of modularized power electronic modules. The I 2 MPECT project aims to demonstrate these achievements with a 45 kW 3-phase bidirectional DC-AC power converter featuring a power to weight ratio of 15 kW/kg at an efficiency of 99% for the power electronics core component. In this project the use of SiC MOSFET should make possible to increase switching frequency to reduce passive components size. However, high switching frequency implies EM (ElectroMagnetic) disturbances that must be taken into account in the design phase. This paper presents detailed lumped circuit model of the advanced layouts of the inverter by combining both Q3D extractor (3D EM Simulator) and SABER software (Electrical Circuit Simulator). This approach allows analysing the distribution of impedances through these layouts and act to improve layout design in order to decrease stray inductance at high frequency. The coupling between Q3D and SABER allows simulating the whole system (layout model, active component model (MOSFET), control part, LISN …). Section II explains the importance of detailed lumped circuit model for EMC analysis. In section III, the simulation approach and layout design improvement are described. The simulation results are summarized in section IV. A conclusion and perspectives are given in section V. II Simulation approach of layout circuit model To analyse EM disturbances and design EMC filters, it's necessary to model the whole power converter in order to get EM signatures. There are two main approaches to get simulation model: the first one is behavioural modelling approach [6] which is suitable when there are no details about inverter layout and it requires few computational time. However, since there is no information about impedance distribution, it is not possible to correlate EM disturbances to the layout. As a result, this technique cannot be used to improve layout. The second one is a detailed lumped circuit modelling approach based on the physics of the circuit. It is the classical way to model any electronic circuit. The interconnections like wires and printed circuit board (PCB) traces are modelled using

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