Combined Surface-Activated Bonding (SAB) Technologies for New Approach to Low Temperature Wafer Bonding
Notice bibliographique
Résumé
Surface activating/cleaning is of great importance for low temperature wafer bonding and various surface activating methods have been studied. Fast atom bombardment activation removes oxides and contaminations on bonding surface and it is efficient for room temperature wafer bonding for semiconductors and metals, etc. Plasma activated bonding has been developed for low temperature hydrophilic bonding for silicon and silicon oxide wafers[1] and Au bonding. Formic acid gas treatment reduces Cu oxide to Cu and then the Cu can be bonded at temperature below 200°C [2]. Water vapor-assisted SAB method introduces water vapor onto the FAB activated surfaces at atmospheric pressure, and then homogeneous and heterogeneous bonding of Cu, SiO 2 , and polyimide can be achieved at 150°C and atmospheric pressure [3]. SAB with a modification using nano-adhesion layer at the interface realized room temperature bonding of polymer films and glass[4]. However, every activating method has its advantages and limitations depending the bonding materials and applications. Thus, there is a need to combine various surface activating methods for novel low temperature wafer bonding approaches development. The objectives of this study are to develop new approach for low temperature wafer bonding by using combined surface-activated bonding (SAB) technologies and to explore the mechanisms of the bonding processes. We used Ar plasma and Ar fast atom bombardment (FAB) to activate the Cu/polymer hybrid surface for removal of Cu native oxide and organic contaminations on Cu surface. X-ray photoelectron spectroscopy (XPS) was used to analyze the chemical composition and state of the activated surfaces. The results show that Ar FAB is more effective for Cu oxides and organic contaminations removal than Ar plasma. The XPS spectra (Figure 1) show that Cu hydroxide, Cu oxides and organic contaminations on Cu surface could be removed by FAB activating for 9 minutes. However, Cu contamination on polymer surface is observed after both Ar plasma and Ar FAB activation. To develop new low temperature bonding approaches, we designed a combined surface-activated bonding system, which consists of two main subsystems: a surface activating subsystem and a wafer bonding subsystem. The surface activating subsystem could employ combined surface activating processes, including oxygen, nitrogen, and fluorine containing plasma, formic acid gas, water vapor and FAB surface treatments. The wafer bonding subsystem could perform wafer alignment and bonding process in ultra high vacuum. In this paper, we report the design and results of a combined surface-activated bonding system that we have constructed to explore the effects of combined surface activating processes on bonding surfaces, and conclude with prospects for the future. References [1] C. Wang and T. Suga, “Room-Temperature Direct Bonding Using Fluorine Containing Plasma Activation,” J. Electrochem. Soc. , vol. 158, no. 5, pp. H525–H529, May 2011. [2] W. Yang, M. Akaike, M. Fujino, and T. Suga, “A New Combined Process of Formic Acid Pretreatment for Low-temperature Bonding of Copper Electrodes,” ECS Trans. , vol. 50, no. 7, pp. 133–138, Mar. 2013. [3] A. Shigetou and T. Suga, “Vapor-Assisted Surface Activation Method for Homo- and Heterogeneous Bonding of Cu, SiO2, and Polyimide at 150°C and Atmospheric Pressure,” J. Electron. Mater. , vol. 41, no. 8, pp. 2274–2280, Aug. 2012. [4] T. Matsumae, M. Nakano, Y. Matsumoto, and T. Suga, “Room Temperature Bonding of Polymer to Glass Wafers Using Surface Activated Bonding (SAB) Method,” ECS Trans. , vol. 50, no. 7, pp. 297–302, Mar. 2013.
Récupéré en direct depuis OpenAlex et désinversé. Les résumés ne sont pas conservés dans cette base de données : les index inversés représentent 8,6 Go des 9,3 Go de texte de la base, et le serveur dispose de 13 Go libres.
Comment cette classification a été obtenuedéplier
Prédiction distillée sur la base complète
Imitation des enseignantsNi prévalence calibrée, ni vérité terrain. Validation humaine à venir. Apprise à partir de 10 348 étiquettes directes de Codex et de 10 348 étiquettes directes de Gemma. Le mode candidate est l'union des têtes enseignantes seuillées; le consensus est leur intersection. Ces sorties portent le statut machine_predicted_unvalidated et ne sont ni des étiquettes humaines ni des étiquettes directes de modèles de pointe.
Scores Codex et Gemma par catégorie
| Catégorie | Codex | Gemma |
|---|---|---|
| Métarecherche | 0,000 | 0,001 |
| Méta-épidémiologie (sens strict) | 0,000 | 0,000 |
| Méta-épidémiologie (sens large) | 0,000 | 0,000 |
| Bibliométrie | 0,000 | 0,000 |
| Études des sciences et des technologies | 0,000 | 0,000 |
| Communication savante | 0,000 | 0,000 |
| Science ouverte | 0,000 | 0,000 |
| Intégrité de la recherche | 0,000 | 0,001 |
| Charge utile insuffisante (le modèle a refusé de juger) | 0,000 | 0,000 |
Scores machine (provisoires)
Les deux têtes enseignantes du modèle étudiant, lues sur ce travail. Un score ordonne la base pour la relecture; il n'affirme jamais une catégorie, et le statut de validation accompagne chaque rangée tel quel.
Scores de référence d'un modèle non mature (critères de maturité non atteints, 7 itérations). Un score ordonne; il n'affirme jamais une catégorie.
score_only:v0-immature-baseline · tel quel depuis la passe de notation : score_only signifie que le nombre peut ordonner les travaux, et qu'aucune étiquette de catégorie n'en découleClassification
machine, non validéePrédiction automatique; un appel candidat d’une seule tête enseignante, pas un consensus.
Le détail, modèle par modèle et score par score, se trouve en fin de page sous « Comment cette classification a été obtenue ».