JCISE Editorial Board—Year 2024

The Journal of Computing and Information Science in Engineering (JCISE) publishes articles related to scientific computing methods (e.g., modeling, simulation, representation, and algorithm) and computational tools (e.g., high-performance computing, virtual and augmented reality) that aim to improve engineering products and systems for their complete lifecycle (e.g., design, manufacturing, operation, maintenance, disposal, and recycling). The interest areas include computer-aided design and manufacturing, computational geometry and geometry processing, cyber-physical-social systems, data analytics and machine learning, engineering optimization, human–computer interface and human modeling, intelligent manufacturing, machine intelligence and robotics system, modeling and simulation and scientific computing, precision engineering and reverse engineering, sustainability and product lifecycle management, and systems engineering and engineering informatics.Yan Wang, Georgia Institute of Technology, USAGaurav Ameta, Siemens Corporate Technology, USANabil Anwer, Ecole Normale Superieure Paris-Sarclay, FranceStephen Baek, University of Virginia, USAWilliam Bernstein, Air Force Research Laboratory, USALinkan Bian, Mississippi State University, USASeung-Kyum Choi, Georgia Institute of Technology, USAChih-Hsing Chu, National Tsing Hua University, TaiwanJonathan Roy Corney, University of Edinburgh, UKKaushal Desai, Indian Institute of Technology Jodhpur, IndiaEhsan Esfahani, State University of New York at Buffalo, USAFrancesco Ferrise, Politecnico di Milano, ItalyAmir H. Gandomi, University of Technology Sydney, AustraliaJohann Guilleminot, Duke University, USAB. Gurumoorthy, Indian Institute of Science, IndiaBin He, Shanghai University, ChinaAjay Joneja, Hong Kong University of Science and Technology, Hong KongKrishnanand Kaipa, Old Dominion University, USATsz-Ho Kwok, Concordia University, CanadaVinayak Raman Krishnamurthy, Texas A&M University, USAGuang Lin, Purdue University, USAYusheng Liu, Zhejiang University, ChinaYan Lu, National Institute of Standards and Technology, USAJianxi Luo, City University of Hong Kong, Hong Kong, ChinaYongsheng Ma, Southern University of Science and Technology, ChinaSamy Missoum, University of Arizona, USAJohn G. Michopoulos, Naval Research Laboratory, USADuhwan Mun, Korea University, South KoreaAlison Olechowski, University of Toronto, CanadaYayue Pan, University of Illinois at Chicago, USAAnurag Purwar, Stony Brook University, USAP. V. M. Rao, Indian Institute of Technology Delhi, IndiaCaterina Rizzi, University of Bergamo, ItalyKazuhiro Saitou, University of Michigan, USAShana Smith, National Taiwan University, TaiwanYu Song, Delft University of Technology, The NetherlandsKrishnan Suresh, University of Wisconsin, Madison, USAAtul Thakur, Indian Institute of Technology Patna, IndiaWenmeng Tian, Mississippi State University, USACameron Turner, Clemson University, USADouglas Van Bossuyt, Naval Postgraduate School, USAJun Wang, Nanjing University of Aeronautics and Astronautics, ChinaKristina Wärmefjord, Chalmers University of Technology, SwedenHui Yang, Pennsylvania State University, USAXiaowei Yue, Tsinghua University, ChinaZhinan Zhang, Shanghai Jiao Tong University, ChinaVinayak Raman Krishnamurthy, Texas A&M University, USADouglas Van Bossuyt, Naval Postgraduate School, USAJami J. Shah (Founding Editor-in-Chief), Ohio State University, USABahram Ravani (Former Editor-in-Chief), University of California, Davis, USASatyandra K. Gupta (Former Editor-in-Chief), University of Southern California, USAJanet Allen, University of Oklahoma, USAImre Horváth, Delft University of Technology, The NetherlandsRam D. Sriram, National Institute of Standards and Technology, USAJianrong Tan, Zhejiang University, ChinaAnindya Bhaduri, General Electric Research, USABopaya Bidanda, University of Pittsburgh, USASatish Bukkapatnam, Texas A&M University, USAQing (Cindy) Chang, University of Virginia, USAFrancisco Chinesta, ENSAM Institute of Technology, FranceBianca Maria Colosimo, Politecnico di Milano, ItalyElias Cueto, University of Zaragoza, SpainTonya Custis, Autodesk, USALiang Gao, Huazhong University of Science and Technology, ChinaAkhil Garg, Huazhong University of Science and Technology, ChinaZhaohui Geng, Ohio University, USABabak Heydari, Northeastern University, USAChen Kan, University of Texas at Arlington, USAMegan Konar, University of Illinois at Urbana-Champaign, USAAstrid Layton, Texas A&M University, USADan Li, Clemson University, USAChenang Liu, Oklahoma State University, USADehao Liu, Binghamton University, USAJie Liu, Carleton University, CanadaJunfeng Ma, Mississippi State University, USAZhenguo Nie, Tsinghua University, ChinaEvangelos Niforatos, Delft University of Technology, The NetherlandsZhou Quan, University of Birmingham, UKSandipp Krishnan Ravi, General Electric Research, USARahul Rai, Clemson University, USAZhenghui Sha, University of Texas at Austin, USAZiyou Song, National University of Singapore, SingaporeJohn Steuben, Naval Research Laboratory, USAGregory Vogl, National Institute of Standards and Technology, USAJian-Xun Wang, University of Notre Dame, USAXiaozhi Wang, ABS, USAYinan Wang, Rensselaer Polytechnic Institute, USARobert Wendrich, Rawshaping Technology, The NetherlandsPaul Witherell, National Institute of Standards and Technology, USAMark Yampolskiy, Auburn University, USAFan Zhang, Georgia Institute of Technology, USAPai Zheng, Hong Kong Polytechnic University, ChinaYunbo Zhang, Rochester Institute of Technology, USAFiona Zhao, McGill University, CanadaRegina Neequaye

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