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Record W1536476611 · doi:10.1109/ectc.2015.7159873

Fundamental investigation of lid interactions with TIM1 and adhesive materials for advanced flip chip packaging

2015· article· en· W1536476611 on OpenAlexaff
Lyndon Larson, Yin Tang, Adriana Zambova, Cassandra Hale, Sushumna Iruvanti, Taryn J. Davis, Hai P. Longworth, Richard N. Langlois

Bibliographic record

Venuenot available
Typearticle
Languageen
FieldEngineering
TopicElectronic Packaging and Soldering Technologies
Canadian institutionsIBM (Canada)
Fundersnot available
KeywordsFlip chipMicroelectronicsAdhesiveHeat sinkMaterials scienceMechanical engineeringMaterial propertiesChipReliability (semiconductor)Integrated circuit packagingElectronic packagingComputer scienceNanotechnologyComposite materialOptoelectronicsIntegrated circuitEngineering

Abstract

fetched live from OpenAlex

As flip chip packaging evolves, there are increasing demands on the overall package design in order to maintain reliability while the devices themselves are increasing in performance. A key aspect for advanced flip chip applications that require a heat sink, is to ensure the integrity of the interface between the silicon chip and the heat sink (often a referred to as a lid or heat spreader). The challenging trends for these types of packages include: increased silicon surface areas, changes in substrate type(s), thinner overall package z-heights, and other thermo-mechanical demands which can all result in new, or re-introducing previously-solved, mechanisms that disrupt the thermal interface which is critically important for sufficient heat dissipation. In this research, the relationship between the lid and the materials at this interface is investigated. There are two types of lid/material interactions studied: the lid-to-TIM1 interface and the interface at the perimeter where, for large devices, an auxiliary band of adhesive/sealant is used to improve package reliability. Among the various techniques identified to assess the interactions at this interface, the adhesion performance is considered a primary method. A modified die shear adhesive method was optimized specifically for this application and determined to be the most suitable among several competing adhesion characterization methods. This investigation also includes characterization of the adhesion performance for numerous types of materials using standard microelectronics industry reliability conditions. It was found that following the failure modes, in particular, (as opposed to only the adhesive force data) at select intervals during this battery of stress testing can improve understanding of the interfacial behavior. Additionally, correlation studies were conducted to compare adhesion results with the other techniques typically used at the flip chip package-level, such as manufacturing line parametric tests (e.g. acoustic microscopy) or in the failure analysis lab (dye penetration, cross-sectioning, etc). Finally, an analytical chemistry assessment of the lid surface functionalities was also performed in order to correlate potential chemical interactions with this material set. Subsequently, the feasibility of improving the compatibility between the lid surfaces and the materials was evaluated. A variety of cleaning methods and other techniques were utilized to identify which methods seem to provide some performance benefits without significantly compromising other aspects of the overall package robustness.

Fetched live from OpenAlex and de-inverted. Abstracts are not stored in this database: the inverted indexes are 8.6 GB of the frame’s 9.3 GB of text, and the host has 13 GB free.

How this classification was reachedexpand

Full frame distilled prediction

Teacher imitation

Not calibrated prevalence, not ground truth. Human validation pending. Learned from the 10,348 direct Codex labels and 10,348 direct Gemma labels. Candidate is the union of thresholded teacher heads; consensus is their intersection. These outputs are machine_predicted_unvalidated and are not human labels or direct frontier model labels.

metaresearch head score (Codex)0.000
metaresearch head score (Gemma)0.000
Version: codex-gemma-dda1882f352aValidation status: machine_predicted_unvalidated
Candidate categoriesnone
Consensus categoriesnone
DomainCandidate signal: none · Consensus signal: none
Study designCandidate signal: Bench or experimental · Consensus signal: Bench or experimental
GenreCandidate signal: Empirical · Consensus signal: Empirical
Teacher disagreement score0.008
Threshold uncertainty score0.287

Codex and Gemma teacher scores by category

CategoryCodexGemma
Metaresearch0.0000.000
Meta-epidemiology (narrow)0.0000.000
Meta-epidemiology (broad)0.0000.000
Bibliometrics0.0000.000
Science and technology studies0.0000.000
Scholarly communication0.0000.000
Open science0.0000.000
Research integrity0.0000.000
Insufficient payload (model declined to judge)0.0000.000

Machine scores (provisional)

The two teacher heads of the student model, read on this work. A score orders the frame for review; it never asserts a category, and the validation status ships verbatim with every row.

Baseline scores from an immature model (maturity gate not passed, 7 training rounds). Scores rank; they never assert a category.

Opus teacher head0.022
GPT teacher head0.237
Teacher spread0.215 · how far apart the two teachers sit on this one work
Validation statusscore_only:v0-immature-baseline · verbatim from the scoring run: score_only means the number may rank works, and no category label ships from it

Classification

machine, unvalidated

Machine predicted; a candidate call from one teacher head, not a consensus.

The models applied no category: nothing in the taxonomy fit this work.
Study designBench or experimental
Domainnot available
GenreEmpirical

How this classification was reached, model by model and score by score, is at the end of the page under "How this classification was reached".

Quick stats

Citations2
Published2015
Admission routes1
Has abstractyes

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