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Record W2013929975 · doi:10.1109/ectc.2007.373932

Integrated Modeling of C4 Interconnects

2007· article· en· W2013929975 on OpenAlex

Why this work is in the frame

A frame that forgets how it found something cannot be audited. These are the routes that admitted this work.

affAt least one author lists a Canadian institution in the pinned OpenAlex snapshot.

Bibliographic record

Venuenot available
Typearticle
Languageen
FieldEngineering
TopicElectronic Packaging and Soldering Technologies
Canadian institutionsIBM (Canada)
Fundersnot available
KeywordsFlip chipBall grid arrayInterconnectionSolderingParametric statisticsFinite element methodChipComputer scienceReliability (semiconductor)Boundary value problemMechanical engineeringIntegrated circuit packagingMaterials scienceElectronic engineeringEngineeringStructural engineeringMathematicsPhysicsComposite material

Abstract

fetched live from OpenAlex

An extensive methodology for the numerical modeling of C4 interconnects in flip chip organic packages is presented, with particular emphasis on the variability introduced by the manufacturing process. A number of different analytical and experimental techniques are used to develop a complete mechanical model of the interconnect, in order to infer the characteristics of various packaging options with respect to the reliability of C4 interconnects. A fully parametric "macroscopic" finite element model of the entire module (laminate, underfill, chip, lid structure) is first constructed, and is used to define boundary conditions for "microscopic" models of the interconnects. A flexible software system that allows the complete parameterization of the module (in terms of its topology, scales, and material properties) is described. The geometry of the interconnect is calculated parametrically from first principles using a model of the solder joint in fluid phase, taking into account various properties of the interconnect such as the solder volume, the pad diameters, the relative position of the pads, etc. Data validating this fluid model on BGA and on C4 solder balls are also presented. Finally, the variability inherent to manufacturing flip chip packages is emulated by sampling some of the model parameters from random distributions (examples of such parameters include laminate warpage and solder joint volume, and their influence on global package properties, such as the underfilled gap between laminate and chip). Illustrative examples of applying this methodology for problem solving in a manufacturing environment are also presented.

Fetched live from OpenAlex and de-inverted. Abstracts are not stored in this database: the inverted indexes are 8.6 GB of the frame’s 9.3 GB of text, and the host has 13 GB free.

Full frame distilled prediction

Teacher imitation

Not calibrated prevalence, not ground truth. Human validation pending. Learned from the 10,348 direct Codex labels and 10,348 direct Gemma labels. Candidate is the union of thresholded teacher heads; consensus is their intersection. These outputs are machine_predicted_unvalidated and are not human labels or direct frontier model labels.

metaresearch head score (Codex)0.000
metaresearch head score (Gemma)0.000
Version: codex-gemma-dda1882f352aValidation status: machine_predicted_unvalidated
Candidate categoriesnone
Consensus categoriesnone
DomainCandidate signal: none · Consensus signal: none
Study designCandidate signal: Simulation or modeling · Consensus signal: Simulation or modeling
GenreCandidate signal: Empirical · Consensus signal: Empirical
Teacher disagreement score0.419
Threshold uncertainty score0.227

Codex and Gemma teacher scores by category

CategoryCodexGemma
Metaresearch0.0000.000
Meta-epidemiology (narrow)0.0000.000
Meta-epidemiology (broad)0.0000.000
Bibliometrics0.0000.000
Science and technology studies0.0000.000
Scholarly communication0.0000.000
Open science0.0000.000
Research integrity0.0000.000
Insufficient payload (model declined to judge)0.0000.000

Machine scores (provisional)

The two teacher heads of the student model, read on this work. A score orders the frame for review; it never asserts a category, and the validation status ships verbatim with every row.

Baseline scores from an immature model (maturity gate not passed, 7 training rounds). Scores rank; they never assert a category.

Opus teacher head0.014
GPT teacher head0.217
Teacher spread0.202 · how far apart the two teachers sit on this one work
Validation statusscore_only:v0-immature-baseline · verbatim from the scoring run: score_only means the number may rank works, and no category label ships from it