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Record W2047022984 · doi:10.1142/s0219581x12400157

THROUGH SILICON VIAS INTEGRABLE WITH THIN-FILM PIEZOELECTRIC STRUCTURES

2012· article· en· W2047022984 on OpenAlex

Why this work is in the frame

A frame that forgets how it found something cannot be audited. These are the routes that admitted this work.

affAt least one author lists a Canadian institution in the pinned OpenAlex snapshot.
fundA Canadian funder is recorded on the work.

Bibliographic record

VenueInternational Journal of Nanoscience · 2012
Typearticle
Languageen
FieldEngineering
Topic3D IC and TSV technologies
Canadian institutionsUniversité de Sherbrooke
FundersNatural Sciences and Engineering Research Council of Canada
KeywordsMaterials scienceWaferPiezoelectricityOptoelectronicsMicrofabricationSilicon on insulatorGround planeSiliconLayer (electronics)CapacitanceElectronic engineeringNanotechnologyElectrical engineeringComposite materialFabricationElectrode

Abstract

fetched live from OpenAlex

This paper reports on the design and microfabrication of novel through silicon vias (TSV) that are compatible with high-temperature processing of piezoelectric structures. The present approach uses metal deposition in cavities etched in the SOI handle layer of the wafer and electrically isolated islands in the device layer. This design avoids the shortcomings of previous TSV designs, which either introduce large topologies on the wafer surface, include metals that cannot sustain high-temperature processing or use poor electrical insulators. TSVs microfabricated using this new approach exhibit good performance, specifically small resistance between the front and backside metal pads, isolation from the ground plane and small capacitance between the vias and the ground. These TSVs are eminently suitable for devices requiring high-temperature processing, such as thin-film piezoelectric sensors and actuators.

Fetched live from OpenAlex and de-inverted. Abstracts are not stored in this database: the inverted indexes are 8.6 GB of the frame’s 9.3 GB of text, and the host has 13 GB free.

Full frame distilled prediction

Teacher imitation

Not calibrated prevalence, not ground truth. Human validation pending. Learned from the 10,348 direct Codex labels and 10,348 direct Gemma labels. Candidate is the union of thresholded teacher heads; consensus is their intersection. These outputs are machine_predicted_unvalidated and are not human labels or direct frontier model labels.

metaresearch head score (Codex)0.000
metaresearch head score (Gemma)0.000
Version: codex-gemma-dda1882f352aValidation status: machine_predicted_unvalidated
Candidate categoriesnone
Consensus categoriesnone
DomainCandidate signal: none · Consensus signal: none
Study designCandidate signal: Bench or experimental · Consensus signal: Bench or experimental
GenreCandidate signal: Empirical · Consensus signal: Empirical
Teacher disagreement score0.548
Threshold uncertainty score0.265

Codex and Gemma teacher scores by category

CategoryCodexGemma
Metaresearch0.0000.000
Meta-epidemiology (narrow)0.0000.000
Meta-epidemiology (broad)0.0000.000
Bibliometrics0.0000.000
Science and technology studies0.0000.000
Scholarly communication0.0000.001
Open science0.0010.000
Research integrity0.0000.000
Insufficient payload (model declined to judge)0.0000.000

Machine scores (provisional)

The two teacher heads of the student model, read on this work. A score orders the frame for review; it never asserts a category, and the validation status ships verbatim with every row.

Baseline scores from an immature model (maturity gate not passed, 7 training rounds). Scores rank; they never assert a category.

Opus teacher head0.012
GPT teacher head0.239
Teacher spread0.227 · how far apart the two teachers sit on this one work
Validation statusscore_only:v0-immature-baseline · verbatim from the scoring run: score_only means the number may rank works, and no category label ships from it