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Record W2085252411 · doi:10.1109/tcad.2012.2237226

Testing 3-D IC Through-Silicon-Vias (TSVs) by Direct Probing

2013· article· en· W2085252411 on OpenAlexafffund
Nabeeh Kandalaft, Rashid Rashidzadeh, Majid Ahmadi

Bibliographic record

VenueIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems · 2013
Typearticle
Languageen
FieldEngineering
Topic3D IC and TSV technologies
Canadian institutionsUniversity of Windsor
FundersUniversity of WindsorCMC Microsystems
KeywordsMicroelectromechanical systemsThrough-silicon viaIntegrated circuitElectronic engineeringMaterials scienceSiliconDegradation (telecommunications)Electrical engineeringOptoelectronicsEngineering

Abstract

fetched live from OpenAlex

Testing the integrity of interconnects realized by through silicon vias (TSVs) in 3-D integrated circuits (3-D IC) is considered a challenging task. TSVs are excessively small and fragile for current probe technology. In this paper, a new spring-type probe using microelectromechanical systems (MEMS) technology is presented. The implemented MEMS probe supports the required pitch for TSV direct probing and minimizes the undesired scrub marks on TSV surface. Simulation results indicate that the implemented MEMS probe can operate at the gigahertz frequency range without significant test signal degradation.

Fetched live from OpenAlex and de-inverted. Abstracts are not stored in this database: the inverted indexes are 8.6 GB of the frame’s 9.3 GB of text, and the host has 13 GB free.

How this classification was reachedexpand

Full frame machine prediction

Teacher imitation

Not calibrated prevalence, not ground truth. Human validation pending. The Gemma side is a direct model label for every work in the frame, read from the title-only record. The Codex side is a classifier learned from the 10,348 direct Codex labels and calibrated to design-weighted sample rates; fields without enough sample support carry no Codex call. Candidate is the union of the two sides; consensus is their intersection. These outputs are machine_predicted_unvalidated and are not human labels.

metaresearch head score (Codex)0.000
metaresearch head score (Gemma)0.001
Version: metacan-v3-hybrid-931329e0061cValidation status: machine_predicted_unvalidated
Candidate categoriesnone
Consensus categoriesnone
DomainCandidate signal: none · Consensus signal: none
Study designCandidate signal: Bench or experimental · Consensus signal: Bench or experimental
GenreCandidate signal: Empirical · Consensus signal: Empirical
Teacher disagreement score0.001
Threshold uncertainty score0.003

Distilled classifier scores by category (both heads)

CategoryCodexGemma
Metaresearch0.0000.001
Meta-epidemiology (narrow)0.0000.000
Meta-epidemiology (broad)0.0000.000
Bibliometrics0.0000.000
Science and technology studies0.0000.000
Scholarly communication0.0000.001
Open science0.0000.000
Research integrity0.0000.000
Insufficient payload (model declined to judge)0.0010.000

Machine scores (provisional)

The two teacher heads of the student model, read on this work. A score orders the frame for review; it never asserts a category, and the validation status ships verbatim with every row.

Baseline scores from an immature model (maturity gate not passed, 7 training rounds). Scores rank; they never assert a category.

Opus teacher head0.033
GPT teacher head0.206
Teacher spread0.173 · how far apart the two teachers sit on this one work
Validation statusscore_only:v0-immature-baseline · verbatim from the scoring run: score_only means the number may rank works, and no category label ships from it

Classification

machine, unvalidated

Machine predicted; a candidate call from one source (direct Gemma or distilled Codex), not a consensus.

The models applied no category: nothing in the taxonomy fit this work.
Study designBench or experimental
Domainnot available
GenreEmpirical

How this classification was reached, model by model and score by score, is at the end of the page under "How this classification was reached".

Quick stats

Citations10
Published2013
Admission routes2
Has abstractyes

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Same venueIEEE Transactions on Computer-Aided Design of Integrated Circuits and SystemsSame topic3D IC and TSV technologiesFrench-language works237,207