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Record W2144859652 · doi:10.1109/ipfa.2001.941473

Solder joint fatigue and reliability of chip scale packages: a failure analysis strategy

2002· article· en· W2144859652 on OpenAlexaff
Saiful Bahri Mohamed, Caroline Francis, Lam Boon Yew, Tang Wye Mun, Lim Too Ki

Bibliographic record

Venuenot available
Typearticle
Languageen
FieldEngineering
TopicElectronic Packaging and Soldering Technologies
Canadian institutionsAdvanced Micro Devices (Canada)
Fundersnot available
KeywordsSolderingPrinted circuit boardChip-scale packageJoint (building)Materials scienceReliability (semiconductor)IntermetallicChipReflow solderingSubstrate (aquarium)Structural engineeringMetallurgyEngineeringElectrical engineeringAlloy

Abstract

fetched live from OpenAlex

This paper outlines an optimal approach for board level chip scale package (CSP) failure analysis, where the chip and printed circuit board (PCB) are analyzed as a single unit. A technique using a combination of cross-section and parallel polishing is described in detail. This technique was specifically developed to inspect key aspects of solder joint fatigue, which are solder joint height, pad dimensions on both package and PCB, substrate warpage, heating profiles/reflow, intermetallic compound (IMC) thickness and solder joint voids.

Fetched live from OpenAlex and de-inverted. Abstracts are not stored in this database: the inverted indexes are 8.6 GB of the frame’s 9.3 GB of text, and the host has 13 GB free.

How this classification was reachedexpand

Full frame distilled prediction

Teacher imitation

Not calibrated prevalence, not ground truth. Human validation pending. Learned from the 10,348 direct Codex labels and 10,348 direct Gemma labels. Candidate is the union of thresholded teacher heads; consensus is their intersection. These outputs are machine_predicted_unvalidated and are not human labels or direct frontier model labels.

metaresearch head score (Codex)0.000
metaresearch head score (Gemma)0.000
Version: codex-gemma-dda1882f352aValidation status: machine_predicted_unvalidated
Candidate categoriesnone
Consensus categoriesnone
DomainCandidate signal: none · Consensus signal: none
Study designCandidate signal: Simulation or modeling · Consensus signal: Simulation or modeling
GenreCandidate signal: Empirical · Consensus signal: Empirical
Teacher disagreement score0.217
Threshold uncertainty score0.463

Codex and Gemma teacher scores by category

CategoryCodexGemma
Metaresearch0.0000.000
Meta-epidemiology (narrow)0.0000.000
Meta-epidemiology (broad)0.0000.000
Bibliometrics0.0000.000
Science and technology studies0.0000.000
Scholarly communication0.0000.000
Open science0.0000.000
Research integrity0.0000.000
Insufficient payload (model declined to judge)0.0000.000

Machine scores (provisional)

The two teacher heads of the student model, read on this work. A score orders the frame for review; it never asserts a category, and the validation status ships verbatim with every row.

Baseline scores from an immature model (maturity gate not passed, 7 training rounds). Scores rank; they never assert a category.

Opus teacher head0.021
GPT teacher head0.215
Teacher spread0.194 · how far apart the two teachers sit on this one work
Validation statusscore_only:v0-immature-baseline · verbatim from the scoring run: score_only means the number may rank works, and no category label ships from it

Classification

machine, unvalidated

Machine predicted; a candidate call from one teacher head, not a consensus.

The models applied no category: nothing in the taxonomy fit this work.
Study designSimulation or modeling
Domainnot available
GenreEmpirical

How this classification was reached, model by model and score by score, is at the end of the page under "How this classification was reached".

Quick stats

Citations0
Published2002
Admission routes1
Has abstractyes

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