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Record W2159963606 · doi:10.37665/smscwem73165

Does Copper Dissolution Impact Through-Hole Solder Joint Reliability?

2009· article· en· W2159963606 on OpenAlexaff
Craig Hamilton, Polina Snugovsky, Mario Moreno, Teng Hoon Ng, Juthathip Fangkangwanwong, Matthew Kelly, Marie Cole

Bibliographic record

VenueSMTA International · 2009
Typearticle
Languageen
FieldEngineering
TopicElectronic Packaging and Soldering Technologies
Canadian institutionsIBM (Canada)Hain Celestial (Canada)
Fundersnot available
KeywordsCopperDissolutionMaterials scienceReworkJoint (building)Reliability (semiconductor)SolderingMetallurgyInterconnectionPlating (geology)Structural engineeringEngineeringGeology

Abstract

fetched live from OpenAlex

ABSTRACT The process issues relating to high copper dissolution rates have been well documented within the industry. The copper dissolution rates of SAC305/405 plus many of the leading alternative lead-free wave alloys have been characterized and pin-through-hole rework process windows assessed. One remaining gap within the industry is the understanding of how copper dissolution or thinning of the through-hole barrel wall/knee locations impacts the thermal and mechanical reliability of a pin-through-hole joint. This paper provides a summary of previous work performed to study and characterize the copper dissolution rates of various Pb-free wave alloys, as well as attempts to assess the impact of high levels of copper dissolution on the thermal reliability of a 14 I/O PDIP connector. A total of five PDIP connectors were designed onto a test vehicle, each individually daisy chained using bottomside traces, for in-situ monitoring. A design of experiment was defined as an attempt to vary the level of plated copper remaining after simulating the rework of the five PDIP connectors. Each board was subjected to 0-100°C ATC for 6,000 cycles with in-situ monitoring to detect failures throughout testing using data loggers. The results from this work indicate reliability concerns when a severe degree of copper dissolution occurs and shows signs of reduced reliability due to thinning of the copper plating thickness at the knee location. In addition, mechanical and thermo-mechanical loading are key elements necessary to confirm the reliability of a pinthrough-hole joint, this paper however, focuses on thermal fatigue reliability assessment. Lastly, this paper will highlight limitations of the copper plating measurement methodology used and suggests alternative non-destructive options to inspect for copper dissolution within manufacturing environments.

Fetched live from OpenAlex and de-inverted. Abstracts are not stored in this database: the inverted indexes are 8.6 GB of the frame’s 9.3 GB of text, and the host has 13 GB free.

How this classification was reachedexpand

Full frame machine prediction

Teacher imitation

Not calibrated prevalence, not ground truth. Human validation pending. The Gemma side is a direct model label for every work in the frame, read from the title-only record. The Codex side is a classifier learned from the 10,348 direct Codex labels and calibrated to design-weighted sample rates; fields without enough sample support carry no Codex call. Candidate is the union of the two sides; consensus is their intersection. These outputs are machine_predicted_unvalidated and are not human labels.

metaresearch head score (Codex)0.001
metaresearch head score (Gemma)0.003
Version: metacan-v3-hybrid-931329e0061cValidation status: machine_predicted_unvalidated
Candidate categoriesnone
Consensus categoriesnone
DomainCandidate signal: none · Consensus signal: none
Study designCandidate signal: Bench or experimental · Consensus signal: Bench or experimental
GenreCandidate signal: Empirical · Consensus signal: Empirical
Teacher disagreement score0.002
Threshold uncertainty score0.005

Distilled classifier scores by category (both heads)

CategoryCodexGemma
Metaresearch0.0010.003
Meta-epidemiology (narrow)0.0000.000
Meta-epidemiology (broad)0.0000.000
Bibliometrics0.0000.000
Science and technology studies0.0000.000
Scholarly communication0.0010.001
Open science0.0000.000
Research integrity0.0010.000
Insufficient payload (model declined to judge)0.0020.000

Machine scores (provisional)

The two teacher heads of the student model, read on this work. A score orders the frame for review; it never asserts a category, and the validation status ships verbatim with every row.

Baseline scores from an immature model (maturity gate not passed, 7 training rounds). Scores rank; they never assert a category.

Opus teacher head0.011
GPT teacher head0.260
Teacher spread0.249 · how far apart the two teachers sit on this one work
Validation statusscore_only:v0-immature-baseline · verbatim from the scoring run: score_only means the number may rank works, and no category label ships from it

Classification

machine, unvalidated

Machine predicted; a candidate call from one source (direct Gemma or distilled Codex), not a consensus.

The models applied no category: nothing in the taxonomy fit this work.
Study designBench or experimental
Domainnot available
GenreEmpirical

How this classification was reached, model by model and score by score, is at the end of the page under "How this classification was reached".

Quick stats

Citations2
Published2009
Admission routes1
Has abstractyes

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