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Record W2199590378 · doi:10.1115/icnmm2015-48830

Microchannel Design Study for 3D Microelectronics Cooling Using a Hybrid Analytical and Finite Element Method

2015· article· en· W2199590378 on OpenAlexafffund
Louis-Michel Collin, Vincent Fiori, P. Coudrain, S. Lhostis, S. Chéramy, Jean-Philippe Colonna, B. Mathieu, A. Souifi, Luc G. Fréchette

Bibliographic record

Venuenot available
Typearticle
Languageen
FieldEngineering
TopicHeat Transfer and Optimization
Canadian institutionsUniversité de Sherbrooke
FundersNatural Sciences and Engineering Research Council of CanadaCentre National de la Recherche Scientifique
KeywordsMultiphysicsMicrochannelMicroelectronicsFlip chipFinite element methodMechanical engineeringMaterials scienceThermal conductivityHeat transferComputer coolingThermal resistanceDiscretizationThermal conductionChipElectronic engineeringComputer scienceMechanicsEngineeringOptoelectronicsElectrical engineeringNanotechnologyLayer (electronics)Composite materialStructural engineeringThermal management of electronic devices and systemsPhysics

Abstract

fetched live from OpenAlex

For microelectronics cooling, microchannels are a potential solution to ensure reliability without sacrificing compactness, as they require relatively small space to remove high heat fluxes compared to air cooling. However, designing microchannels is a complex task where simulation models become a forefront tool to investigate and propose new solutions to increase the chip thermal performances with minimal impact on other aspects. This work evaluates numerically the impact of microchannel cooling in a standalone chip and a 3D assembly of two stacked chips with localized heat sources. To do so, a modeling approach was developed to combine finite element modeling of conduction in the chip using commercial software with analytical relations to capture the heat transfer and fluid flow in the microchannels. This approach leverages the multiphysics and post-processing capabilities of commercial software, but avoids the extensive discretization that would normally be required in microchannels with full finite element modeling. The study shows that increasing the flow rate is not as beneficial as increasing the number of channels (with constant total cross-section area). The effect of heat spreading was also found to be critical, favoring thicker dies. When switching to 3D chip configuration, the interdie underfill layer significantly increases the total thermal resistance and must be considered for thermal design. This effect can be significantly alleviated by increasing the interdie thermal conductivity through adding copper micropillars.

Fetched live from OpenAlex and de-inverted. Abstracts are not stored in this database: the inverted indexes are 8.6 GB of the frame’s 9.3 GB of text, and the host has 13 GB free.

How this classification was reachedexpand

Full frame distilled prediction

Teacher imitation

Not calibrated prevalence, not ground truth. Human validation pending. Learned from the 10,348 direct Codex labels and 10,348 direct Gemma labels. Candidate is the union of thresholded teacher heads; consensus is their intersection. These outputs are machine_predicted_unvalidated and are not human labels or direct frontier model labels.

metaresearch head score (Codex)0.001
metaresearch head score (Gemma)0.000
Version: codex-gemma-dda1882f352aValidation status: machine_predicted_unvalidated
Candidate categoriesnone
Consensus categoriesnone
DomainCandidate signal: none · Consensus signal: none
Study designCandidate signal: Simulation or modeling · Consensus signal: Simulation or modeling
GenreCandidate signal: Methods · Consensus signal: Methods
Teacher disagreement score0.440
Threshold uncertainty score0.478

Codex and Gemma teacher scores by category

CategoryCodexGemma
Metaresearch0.0010.000
Meta-epidemiology (narrow)0.0000.000
Meta-epidemiology (broad)0.0000.000
Bibliometrics0.0000.000
Science and technology studies0.0000.000
Scholarly communication0.0000.000
Open science0.0000.000
Research integrity0.0000.000
Insufficient payload (model declined to judge)0.0000.000

Machine scores (provisional)

The two teacher heads of the student model, read on this work. A score orders the frame for review; it never asserts a category, and the validation status ships verbatim with every row.

Baseline scores from an immature model (maturity gate not passed, 7 training rounds). Scores rank; they never assert a category.

Opus teacher head0.066
GPT teacher head0.307
Teacher spread0.241 · how far apart the two teachers sit on this one work
Validation statusscore_only:v0-immature-baseline · verbatim from the scoring run: score_only means the number may rank works, and no category label ships from it

Classification

machine, unvalidated

Machine predicted; a candidate call from one teacher head, not a consensus.

The models applied no category: nothing in the taxonomy fit this work.
Study designSimulation or modeling
Domainnot available
GenreMethods

How this classification was reached, model by model and score by score, is at the end of the page under "How this classification was reached".

Quick stats

Citations3
Published2015
Admission routes2
Has abstractyes

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