Thermomechanical Characteristics of Copper Through-Silicon via Structures
Why this work is in the frame
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Bibliographic record
Abstract
The 3-D integrated circuit technologies with through-silicon via (TSV) structure have been attracting increasing attentions due to enhanced microchip function and performance. However, the high residual stress in the TSV structure caused by a mismatch of thermal expansion between copper and its surrounding substrate is a potential risk for the reliability of the chip performance. In this paper, the characteristics of thermomechanical behavior in a wafer with copper TSVs were studied using electron backscattered diffraction (EBSD) and finite-element modeling. The high-resolution strain distribution maps were obtained using EBSD-based kernel average misorientation method. The results provided direct observation of the local strain in copper TSV, and the microstructural characteristics of copper TSV were also investigated. Finite-element analysis was performed to determine the stress distributions and to account for the strain in TSV observed through EBSD and scanning electron microscopy.
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Full frame distilled prediction
Teacher imitationNot calibrated prevalence, not ground truth. Human validation pending. Learned from the 10,348 direct Codex labels and 10,348 direct Gemma labels. Candidate is the union of thresholded teacher heads; consensus is their intersection. These outputs are machine_predicted_unvalidated and are not human labels or direct frontier model labels.
Codex and Gemma teacher scores by category
| Category | Codex | Gemma |
|---|---|---|
| Metaresearch | 0.000 | 0.000 |
| Meta-epidemiology (narrow) | 0.000 | 0.000 |
| Meta-epidemiology (broad) | 0.000 | 0.000 |
| Bibliometrics | 0.000 | 0.000 |
| Science and technology studies | 0.000 | 0.000 |
| Scholarly communication | 0.000 | 0.000 |
| Open science | 0.000 | 0.000 |
| Research integrity | 0.000 | 0.000 |
| Insufficient payload (model declined to judge) | 0.000 | 0.000 |
Machine scores (provisional)
The two teacher heads of the student model, read on this work. A score orders the frame for review; it never asserts a category, and the validation status ships verbatim with every row.
Baseline scores from an immature model (maturity gate not passed, 7 training rounds). Scores rank; they never assert a category.
score_only:v0-immature-baseline · verbatim from the scoring run: score_only means the number may rank works, and no category label ships from it