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Record W2324213395 · doi:10.1149/ma2015-01/40/2116

(Invited) Design and Characterization of a New Low Cost Thick Film Copper Metallization Transfer Process Onto PDMS Enabling Stretchable Electronics

2015· article· en· W2324213395 on OpenAlex

Why this work is in the frame

A frame that forgets how it found something cannot be audited. These are the routes that admitted this work.

affAt least one author lists a Canadian institution in the pinned OpenAlex snapshot.

Bibliographic record

VenueECS Meeting Abstracts · 2015
Typearticle
Languageen
FieldMaterials Science
TopicCopper Interconnects and Reliability
Canadian institutionsSimon Fraser University
Fundersnot available
KeywordsMaterials sciencePhotoresistFabricationElectroplatingLayer (electronics)Copper platingPolydimethylsiloxaneElectrical conductorFlexible electronicsElectronicsNanotechnologyStretchable electronicsMicrofabricationCopperTransfer printingOptoelectronicsComposite materialElectrical engineeringMetallurgy

Abstract

fetched live from OpenAlex

We present a new low cost microfabrication technology that utilizes a sacrificial conductive paint transfer method to realize thick film copper microstructures that are embedded in polydimethylsiloxane (PDMS). Several example structures are fabricated and characterized that demonstrate the potential application of this process in flexible electronics, wearable electronics, and novel microsensor and actuator designs. This process has reduced fabrication complexity and cost compared to existing metal-on-PDMS techniques, and enables large scale rapid prototyping of designs using minimal laboratory equipment. This technology differs from others in its use of a conductive copper paint seed layer and a unique transfer process that results in copper microstuctures embedded in PDMS rather than on top of the PDMS surface. The fabrication process begins with the deposition of the seed layer onto a flexible substrate via airbrushing. A dry film photoresist layer is laminated on top and patterned using standard techniques. Electroplated copper is grown on the seed layer through the photoresist mask and transferred to PDMS through a unique baking procedure. This baking transfer process releases the electroplated copper from the seed layer, permanently embedding it into the cured PDMS. The characterization of the copper microstructures is given in terms of feature size, film thickness, surface roughness, and resistivity. The resistivity is measured under static conditions as well as under conditions of flexing and stretching using various linear and 1-dimensional Peano curve structures [1]. To quantify the stability of a structure’s conductivity under flexing, linear structures are bent over curves having various radii and the response of the resistivity is measured against the number of iterations. To measure the response under stretching, 1-dimensional Peano curve structures are fabricated and stretched until failure, while the resistivity is measured against the strain. Results show that we can achieve films 25-75 micrometers in thickness, with reliable feature sizes down to 100 micrometers and a film resistivity of approximately 7.15 micro-Ω-cm [2]. Results from current experiments will be presented that characterize the resistivity response under flexing and stretching. Process variants and future work are discussed, as well as large scale adaptations and rapid prototyping. Finally, we outline the potential uses of this technology in flexible electronics and novel sensor and actuator designs. [1] J.A. Fan, W.-H. Yeo, Y. Su, Y. Hattori, W. Lee, S.-Y. Jung, Y. Zhang, Z. Liu, H. Cheng, L. Falgout, M. Bajema, T. Coleman, D. Gregoire, R. J. Larsen, Y. Huang, J. A. Rogers, “Fractal design concepts for stretchable electronics,” Nature Communications 5 (3266), 2014. [2] D. Hilbich, A. Khosla, L. Shannon, B. L. Gray, “A new low-cost, thick-film metallization transfer process onto PDMS using a sacrificial copper seed,” SPIE 9060, Nanosensors, Biosensors, and Info-Tech Sensors and Systems (906007), 2014

Fetched live from OpenAlex and de-inverted. Abstracts are not stored in this database: the inverted indexes are 8.6 GB of the frame’s 9.3 GB of text, and the host has 13 GB free.

Full frame distilled prediction

Teacher imitation

Not calibrated prevalence, not ground truth. Human validation pending. Learned from the 10,348 direct Codex labels and 10,348 direct Gemma labels. Candidate is the union of thresholded teacher heads; consensus is their intersection. These outputs are machine_predicted_unvalidated and are not human labels or direct frontier model labels.

metaresearch head score (Codex)0.002
metaresearch head score (Gemma)0.001
Version: codex-gemma-dda1882f352aValidation status: machine_predicted_unvalidated
Candidate categoriesnone
Consensus categoriesnone
DomainCandidate signal: none · Consensus signal: none
Study designCandidate signal: Bench or experimental · Consensus signal: Bench or experimental
GenreCandidate signal: Empirical · Consensus signal: Empirical
Teacher disagreement score0.041
Threshold uncertainty score0.685

Codex and Gemma teacher scores by category

CategoryCodexGemma
Metaresearch0.0020.001
Meta-epidemiology (narrow)0.0000.000
Meta-epidemiology (broad)0.0000.000
Bibliometrics0.0000.000
Science and technology studies0.0000.000
Scholarly communication0.0000.000
Open science0.0000.000
Research integrity0.0000.000
Insufficient payload (model declined to judge)0.0000.000

Machine scores (provisional)

The two teacher heads of the student model, read on this work. A score orders the frame for review; it never asserts a category, and the validation status ships verbatim with every row.

Baseline scores from an immature model (maturity gate not passed, 7 training rounds). Scores rank; they never assert a category.

Opus teacher head0.031
GPT teacher head0.260
Teacher spread0.228 · how far apart the two teachers sit on this one work
Validation statusscore_only:v0-immature-baseline · verbatim from the scoring run: score_only means the number may rank works, and no category label ships from it