High-Speed Cu-TSV for 5:1 iTSV Applications
Why this work is in the frame
A frame that forgets how it found something cannot be audited. These are the routes that admitted this work.
Bibliographic record
Abstract
Transition from two-dimensional (2D) to three-dimensional (3D) integration seems to be critical for achieving miniaturization and increased performance and an unavoidable trend for the semiconductor industry. Because of the large variety of applications and requirements as well as a equipment and processes available today for 3D Interconnect, there are still questions about choosing the most suitable integration solutions that can not only provide the performance and advancements required for next generation electronic devices, however a cost effective implementation as well. This paper will address 3D integration using copper electrodeposited through silicon vias (TSV) technology. Various process parameters, such as via profile, seed layer uniformity, wettability and chemical stability as well as process parameters and equipment design were found to be critical in successfully filling TSV structures using copper electrodeposition. This paper will describe the effect of these factors with a focus on the challenges and costs associated with interconnect type TSV structures (iTSV).
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Full frame distilled prediction
Teacher imitationNot calibrated prevalence, not ground truth. Human validation pending. Learned from the 10,348 direct Codex labels and 10,348 direct Gemma labels. Candidate is the union of thresholded teacher heads; consensus is their intersection. These outputs are machine_predicted_unvalidated and are not human labels or direct frontier model labels.
Codex and Gemma teacher scores by category
| Category | Codex | Gemma |
|---|---|---|
| Metaresearch | 0.000 | 0.000 |
| Meta-epidemiology (narrow) | 0.000 | 0.000 |
| Meta-epidemiology (broad) | 0.000 | 0.000 |
| Bibliometrics | 0.000 | 0.000 |
| Science and technology studies | 0.000 | 0.000 |
| Scholarly communication | 0.000 | 0.000 |
| Open science | 0.000 | 0.000 |
| Research integrity | 0.000 | 0.000 |
| Insufficient payload (model declined to judge) | 0.000 | 0.000 |
Machine scores (provisional)
The two teacher heads of the student model, read on this work. A score orders the frame for review; it never asserts a category, and the validation status ships verbatim with every row.
Baseline scores from an immature model (maturity gate not passed, 7 training rounds). Scores rank; they never assert a category.
score_only:v0-immature-baseline · verbatim from the scoring run: score_only means the number may rank works, and no category label ships from it