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Record W2604397886 · doi:10.1116/1.4979709

Atomic layer deposited ultrathin metal nitride barrier layers for ruthenium interconnect applications

2017· article· en· W2604397886 on OpenAlex

Why this work is in the frame

A frame that forgets how it found something cannot be audited. These are the routes that admitted this work.

affAt least one author lists a Canadian institution in the pinned OpenAlex snapshot.
fundA Canadian funder is recorded on the work.

Bibliographic record

VenueJournal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2017
Typearticle
Languageen
FieldMaterials Science
TopicCopper Interconnects and Reliability
Canadian institutionsCanadian Light Source (Canada)
FundersDivision of Materials ResearchNational Institute of General Medical SciencesWestern Economic Diversification CanadaNatural Sciences and Engineering Research Council of CanadaCanadian Institutes of Health ResearchNational Research Council CanadaCanada Foundation for InnovationNational Science FoundationNational Institutes of HealthUniversity of SaskatchewanCanadian Light Source
KeywordsMaterials scienceOverlayerDiffusion barrierAtomic layer depositionSilicideBarrier layerRutheniumTantalum nitrideTinChemical engineeringAnnealing (glass)Chemical vapor depositionCrystallinityNitrideNanotechnologyLayer (electronics)OptoelectronicsComposite materialMetallurgyChemistry

Abstract

fetched live from OpenAlex

Resistance capacitance time delay in Cu interconnects is becoming a significant factor requiring further performance improvements in future nanoelectronic devices. Choice of alternate interconnect materials, for example, refractory metals, and subsequent integration with underlying barrier and liner layers are extremely challenging for the sub-10 nm nodes. The development of conformal deposition processes for alternate interconnects, liner, and barrier materials are crucial in order for implementation of a possible replacement for Cu interconnects for narrow line widths. In this study, the authors report on ultrathin (∼3 nm) chemical vapor deposition (CVD) grown ruthenium films on 0.5 and 1 nm thick metal nitride (TiN, TaN) barrier layers deposited via atomic layer deposition (ALD). Using scanning electron microscopy, the authors determined the effect of the underlying barrier layer on the coverage of the ruthenium overlayer. The authors utilized synchrotron x-ray diffraction with in situ rapid thermal annealing to investigate the thermal stability of the barrier layers and determine the effective activation energies of barrier failure leading to ruthenium monosilicide formation. For Ru films deposited directly on Si and on 0.5 nm MN (M = Ti, Ta) covered Si substrates, silicide formation proceeds via a two-step crystallization process involving lateral nucleation above ∼440 °C followed by thickening of the ruthenium monosilicide layer above ∼520 °C. This silicidation temperature of ∼440 °C could be potentially problematic in back-end-of-the-line (BEOL) processing since it is close to the typical thermal budget used. However ∼1 nm thick ALD MN (M = Ti, Ta) was found to be adequate to block silicide formation up to ∼580 and ∼620 °C for TiN and TaN, respectively, and also aided in superior coverage of the CVD ruthenium overlayer (>90%). The results reported here might be useful to ascertain annealing temperature and time for BEOL process and integration optimization without reaching a state where ruthenium silicides start forming.

Fetched live from OpenAlex and de-inverted. Abstracts are not stored in this database: the inverted indexes are 8.6 GB of the frame’s 9.3 GB of text, and the host has 13 GB free.

Full frame distilled prediction

Teacher imitation

Not calibrated prevalence, not ground truth. Human validation pending. Learned from the 10,348 direct Codex labels and 10,348 direct Gemma labels. Candidate is the union of thresholded teacher heads; consensus is their intersection. These outputs are machine_predicted_unvalidated and are not human labels or direct frontier model labels.

metaresearch head score (Codex)0.002
metaresearch head score (Gemma)0.001
Version: codex-gemma-dda1882f352aValidation status: machine_predicted_unvalidated
Candidate categoriesScience and technology studies
Consensus categoriesnone
DomainCandidate signal: none · Consensus signal: none
Study designCandidate signal: Bench or experimental · Consensus signal: Bench or experimental
GenreCandidate signal: Empirical · Consensus signal: Empirical
Teacher disagreement score0.011
Threshold uncertainty score1.000

Codex and Gemma teacher scores by category

CategoryCodexGemma
Metaresearch0.0020.001
Meta-epidemiology (narrow)0.0000.000
Meta-epidemiology (broad)0.0010.000
Bibliometrics0.0010.000
Science and technology studies0.0020.002
Scholarly communication0.0010.001
Open science0.0020.000
Research integrity0.0000.000
Insufficient payload (model declined to judge)0.0000.000

Machine scores (provisional)

The two teacher heads of the student model, read on this work. A score orders the frame for review; it never asserts a category, and the validation status ships verbatim with every row.

Baseline scores from an immature model (maturity gate not passed, 7 training rounds). Scores rank; they never assert a category.

Opus teacher head0.016
GPT teacher head0.291
Teacher spread0.275 · how far apart the two teachers sit on this one work
Validation statusscore_only:v0-immature-baseline · verbatim from the scoring run: score_only means the number may rank works, and no category label ships from it