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Packaging Renaissance with Chiplets

2019· article· en· W2996572943 on OpenAlex

Why this work is in the frame

A frame that forgets how it found something cannot be audited. These are the routes that admitted this work.

affAt least one author lists a Canadian institution in the pinned OpenAlex snapshot.

Bibliographic record

VenueIMAPSource Proceedings · 2019
Typearticle
Languageen
FieldEngineering
Topic3D IC and TSV technologies
Canadian institutionsAdvanced Micro Devices (Canada)
Fundersnot available
KeywordsComputer scienceEmerging technologiesManufacturing engineeringChipThe RenaissancePackaging engineeringPortfolioEmbedded systemTelecommunicationsEngineeringBusinessMechanical engineering

Abstract

fetched live from OpenAlex

Abstract With ever shrinking advanced CMOS nodes and evolution of systems with increasing complexity, the traditional SoC paradigm is facing extensive challenges in terms of yields and heterogeneity. The emerging industry solution to this has been to partition the SoCs into smaller units, with each unit performing a certain (though exclusive) function. This drove the birth of “chiplets”. With advent of chiplets, the traditional function of packaging as an after-thought to chip development has got a revolutionary face-lift. Packaging is now enabling interconnects to replace on-chip global interconnects. The onus now is on packaging to get the chiplets to integrate and communicate with each other such that the net performance is equivalent to or better than SoC. This has spawned a renaissance in field of semiconductor packaging, with newer multi-die packaging technologies being productized to realize newer and better interconnects. Some examples of these emerging technologies include advanced flip-chip, 2.5D, 2.1D, 3D, Wafer Level Fan-Out, and Bridge Technologies. AMD is at forefront of chiplet technologies, with extensive 7nm chiplet based product portfolio catering to the HPC market. This talk will discuss the current state of chiplet packaging technologies.

Fetched live from OpenAlex and de-inverted. Abstracts are not stored in this database: the inverted indexes are 8.6 GB of the frame’s 9.3 GB of text, and the host has 13 GB free.

Full frame distilled prediction

Teacher imitation

Not calibrated prevalence, not ground truth. Human validation pending. Learned from the 10,348 direct Codex labels and 10,348 direct Gemma labels. Candidate is the union of thresholded teacher heads; consensus is their intersection. These outputs are machine_predicted_unvalidated and are not human labels or direct frontier model labels.

metaresearch head score (Codex)0.000
metaresearch head score (Gemma)0.000
Version: codex-gemma-dda1882f352aValidation status: machine_predicted_unvalidated
Candidate categoriesnone
Consensus categoriesnone
DomainCandidate signal: none · Consensus signal: none
Study designCandidate signal: Observational · Consensus signal: none
GenreCandidate signal: Empirical · Consensus signal: Empirical
Teacher disagreement score0.612
Threshold uncertainty score0.533

Codex and Gemma teacher scores by category

CategoryCodexGemma
Metaresearch0.0000.000
Meta-epidemiology (narrow)0.0000.000
Meta-epidemiology (broad)0.0000.000
Bibliometrics0.0000.000
Science and technology studies0.0000.000
Scholarly communication0.0000.000
Open science0.0000.000
Research integrity0.0000.000
Insufficient payload (model declined to judge)0.0000.000

Machine scores (provisional)

The two teacher heads of the student model, read on this work. A score orders the frame for review; it never asserts a category, and the validation status ships verbatim with every row.

Baseline scores from an immature model (maturity gate not passed, 7 training rounds). Scores rank; they never assert a category.

Opus teacher head0.003
GPT teacher head0.150
Teacher spread0.148 · how far apart the two teachers sit on this one work
Validation statusscore_only:v0-immature-baseline · verbatim from the scoring run: score_only means the number may rank works, and no category label ships from it