Overcoming Chip Shortages: Low-Cost Open-Source Parametric 3-D Printable Solderless SOIC to DIP Breakout Adapters
Why this work is in the frame
A frame that forgets how it found something cannot be audited. These are the routes that admitted this work.
Bibliographic record
Abstract
The COVID-19 pandemic exposed the vulnerability of global supply chains of many products. One area that requires improved supply chain resilience and that is of particular importance to electronic designers is the shortage of basic dual in-line package (DIP) electronic components commonly used for prototyping. This anecdotal observation was investigated as a case study of using additive manufacturing to enforce contact between premade, off-the-shelf conductors to allow for electrical continuity between two arbitrary points by examining data relating to the stock quantity of electronic components, extracted from Digi-Key Electronics. This study applies this concept using an open hardware approach for the design, testing, and use of a simple, parametric, 3-D printable invention that allows for small outline integrated circuit (SOIC) components to be used in DIP package circuits (i.e., breadboards, protoboards, etc.). The additive manufacture breakout board (AMBB) design was developed using two different open-source modelers, OpenSCAD and FreeCAD, to provide reliable and consistent electrical contact between the component and the rest of the circuit and was demonstrated with reusable 8-SOIC to DIP breakout adapters. The three-part design was optimized for manufacturing with RepRap-class fused filament 3-D printers, making the AMBB a prime candidate for use in distributed manufacturing models. The AMBB offers increased flexibility during circuit prototyping by allowing arbitrary connections between the component and prototyping interface as well as superior organization through the ability to color-code different component types. The cost of the AMBB is CAD $0.066/unit, which is a 94% saving compared to conventional PCB-based breakout boards. Use of the AMBB device can provide electronics designers with an increased selection of components for through-hole use by more than a factor of seven. Future development of AMBB devices to allow for low-cost conversion between arbitrary package types provides a path towards more accessible and inclusive electronics design as well as faster prototyping and technical innovation.
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Full frame distilled prediction
Teacher imitationNot calibrated prevalence, not ground truth. Human validation pending. Learned from the 10,348 direct Codex labels and 10,348 direct Gemma labels. Candidate is the union of thresholded teacher heads; consensus is their intersection. These outputs are machine_predicted_unvalidated and are not human labels or direct frontier model labels.
Codex and Gemma teacher scores by category
| Category | Codex | Gemma |
|---|---|---|
| Metaresearch | 0.000 | 0.000 |
| Meta-epidemiology (narrow) | 0.000 | 0.000 |
| Meta-epidemiology (broad) | 0.000 | 0.000 |
| Bibliometrics | 0.001 | 0.001 |
| Science and technology studies | 0.000 | 0.000 |
| Scholarly communication | 0.000 | 0.000 |
| Open science | 0.001 | 0.001 |
| Research integrity | 0.000 | 0.000 |
| Insufficient payload (model declined to judge) | 0.000 | 0.001 |
Machine scores (provisional)
The two teacher heads of the student model, read on this work. A score orders the frame for review; it never asserts a category, and the validation status ships verbatim with every row.
Baseline scores from an immature model (maturity gate not passed, 7 training rounds). Scores rank; they never assert a category.
score_only:v0-immature-baseline · verbatim from the scoring run: score_only means the number may rank works, and no category label ships from it