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Record W4363675324 · doi:10.3390/inventions8020061

Overcoming Chip Shortages: Low-Cost Open-Source Parametric 3-D Printable Solderless SOIC to DIP Breakout Adapters

2023· article· en· W4363675324 on OpenAlexafffund
Cameron K. Brooks, Jack E. Peplinski, Joshua M. Pearce

Bibliographic record

VenueInventions · 2023
Typearticle
Languageen
FieldEngineering
TopicAdditive Manufacturing and 3D Printing Technologies
Canadian institutionsWestern University
FundersNatural Sciences and Engineering Research Council of Canada
KeywordsElectronic componentComputer scienceComponent (thermodynamics)ElectronicsEmbedded systemComputer hardwareElectrical engineeringEngineering

Abstract

fetched live from OpenAlex

The COVID-19 pandemic exposed the vulnerability of global supply chains of many products. One area that requires improved supply chain resilience and that is of particular importance to electronic designers is the shortage of basic dual in-line package (DIP) electronic components commonly used for prototyping. This anecdotal observation was investigated as a case study of using additive manufacturing to enforce contact between premade, off-the-shelf conductors to allow for electrical continuity between two arbitrary points by examining data relating to the stock quantity of electronic components, extracted from Digi-Key Electronics. This study applies this concept using an open hardware approach for the design, testing, and use of a simple, parametric, 3-D printable invention that allows for small outline integrated circuit (SOIC) components to be used in DIP package circuits (i.e., breadboards, protoboards, etc.). The additive manufacture breakout board (AMBB) design was developed using two different open-source modelers, OpenSCAD and FreeCAD, to provide reliable and consistent electrical contact between the component and the rest of the circuit and was demonstrated with reusable 8-SOIC to DIP breakout adapters. The three-part design was optimized for manufacturing with RepRap-class fused filament 3-D printers, making the AMBB a prime candidate for use in distributed manufacturing models. The AMBB offers increased flexibility during circuit prototyping by allowing arbitrary connections between the component and prototyping interface as well as superior organization through the ability to color-code different component types. The cost of the AMBB is CAD $0.066/unit, which is a 94% saving compared to conventional PCB-based breakout boards. Use of the AMBB device can provide electronics designers with an increased selection of components for through-hole use by more than a factor of seven. Future development of AMBB devices to allow for low-cost conversion between arbitrary package types provides a path towards more accessible and inclusive electronics design as well as faster prototyping and technical innovation.

Fetched live from OpenAlex and de-inverted. Abstracts are not stored in this database: the inverted indexes are 8.6 GB of the frame’s 9.3 GB of text, and the host has 13 GB free.

How this classification was reachedexpand

Full frame machine prediction

Teacher imitation

Not calibrated prevalence, not ground truth. Human validation pending. The Gemma side is a direct model label for every work in the frame, read from the title-only record. The Codex side is a classifier learned from the 10,348 direct Codex labels and calibrated to design-weighted sample rates; fields without enough sample support carry no Codex call. Candidate is the union of the two sides; consensus is their intersection. These outputs are machine_predicted_unvalidated and are not human labels.

metaresearch head score (Codex)0.001
metaresearch head score (Gemma)0.003
Version: metacan-v3-hybrid-931329e0061cValidation status: machine_predicted_unvalidated
Candidate categoriesnone
Consensus categoriesnone
DomainCandidate signal: none · Consensus signal: none
Study designCandidate signal: Bench or experimental · Consensus signal: none
GenreCandidate signal: Empirical · Consensus signal: none
Teacher disagreement score0.004
Threshold uncertainty score0.013

Distilled classifier scores by category (both heads)

CategoryCodexGemma
Metaresearch0.0010.003
Meta-epidemiology (narrow)0.0000.000
Meta-epidemiology (broad)0.0000.000
Bibliometrics0.0010.000
Science and technology studies0.0000.000
Scholarly communication0.0010.001
Open science0.0020.001
Research integrity0.0010.001
Insufficient payload (model declined to judge)0.0040.002

Machine scores (provisional)

The two teacher heads of the student model, read on this work. A score orders the frame for review; it never asserts a category, and the validation status ships verbatim with every row.

Baseline scores from an immature model (maturity gate not passed, 7 training rounds). Scores rank; they never assert a category.

Opus teacher head0.046
GPT teacher head0.278
Teacher spread0.232 · how far apart the two teachers sit on this one work
Validation statusscore_only:v0-immature-baseline · verbatim from the scoring run: score_only means the number may rank works, and no category label ships from it

Classification

machine, unvalidated

Machine predicted; a candidate call from one source (direct Gemma or distilled Codex), not a consensus.

The models applied no category: nothing in the taxonomy fit this work.
Study designBench or experimental
Domainnot available
GenreEmpirical

How this classification was reached, model by model and score by score, is at the end of the page under "How this classification was reached".

Quick stats

Citations3
Published2023
Admission routes2
Has abstractyes

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