MétaCan
Menu
Back to cohort
Record W4385901134 · doi:10.1109/ectc51909.2023.00180

Direct Bonded Heterogeneous Integration (DBHi): Surface Bridge Approach for Die Tiling

2023· article· en· W4385901134 on OpenAlex

Why this work is in the frame

A frame that forgets how it found something cannot be audited. These are the routes that admitted this work.

affAt least one author lists a Canadian institution in the pinned OpenAlex snapshot.

Bibliographic record

Venuenot available
Typearticle
Languageen
FieldEngineering
Topic3D IC and TSV technologies
Canadian institutionsIBM (Canada)
Fundersnot available
KeywordsFabricationChipBridge (graph theory)Routing (electronic design automation)Topology (electrical circuits)Computer scienceMechanical engineeringElectrical engineeringEngineeringEmbedded systemTelecommunications

Abstract

fetched live from OpenAlex

With a continuous focus to maximize computational performance by optimizing package size and reducing fabrication costs, this paper presents the most recent advances on the technology of DBHi (Direct Bonded Heterogeneous Integration) packages as a chiplet packaging technology. The optimizations of DBHi are realized by decreasing the bridge chip thickness from <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\mathbf{200}\ \boldsymbol{\mu} \mathbf{m}$</tex> to <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\mathbf{60}\ \boldsymbol{\mu} \mathbf{m}$</tex> and using copper pillars for interconnect, thus enabling the use of standard laminates. The bridge chip that links two main chips features exceptionally fine pitch interconnects <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$(\mathbf{30}-\mathbf{75}\ \boldsymbol{\mu} \mathbf{m})$</tex> with the help of <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\boldsymbol{\mu} \mathbf{C}\mathbf{4}$</tex> providing flexibility in laminate signal routing by eliminating the cavity in the laminate. The assembly method of the sub-assemblies (2 main chips joined to a silicon bridge) has been optimized to achieve robust and reliable joints, the silicon bridge and the main dies are subjected to a preliminary preparation which involves the positioning of the sub-assemblies with TCB (thermocompression bonding) and reflow process for optimal solder joints. This process is achieved without the use of handlers for the bridge die. This paper also documents a comprehensive FEM model describing the effect of bridge thickness, presence of laminate recess and C4 height on package stress.

Fetched live from OpenAlex and de-inverted. Abstracts are not stored in this database: the inverted indexes are 8.6 GB of the frame’s 9.3 GB of text, and the host has 13 GB free.

Full frame distilled prediction

Teacher imitation

Not calibrated prevalence, not ground truth. Human validation pending. Learned from the 10,348 direct Codex labels and 10,348 direct Gemma labels. Candidate is the union of thresholded teacher heads; consensus is their intersection. These outputs are machine_predicted_unvalidated and are not human labels or direct frontier model labels.

metaresearch head score (Codex)0.000
metaresearch head score (Gemma)0.000
Version: codex-gemma-dda1882f352aValidation status: machine_predicted_unvalidated
Candidate categoriesnone
Consensus categoriesnone
DomainCandidate signal: none · Consensus signal: none
Study designCandidate signal: Simulation or modeling · Consensus signal: Simulation or modeling
GenreCandidate signal: Empirical · Consensus signal: Empirical
Teacher disagreement score0.389
Threshold uncertainty score0.399

Codex and Gemma teacher scores by category

CategoryCodexGemma
Metaresearch0.0000.000
Meta-epidemiology (narrow)0.0000.000
Meta-epidemiology (broad)0.0000.000
Bibliometrics0.0000.000
Science and technology studies0.0000.000
Scholarly communication0.0000.000
Open science0.0000.000
Research integrity0.0000.000
Insufficient payload (model declined to judge)0.0000.000

Machine scores (provisional)

The two teacher heads of the student model, read on this work. A score orders the frame for review; it never asserts a category, and the validation status ships verbatim with every row.

Baseline scores from an immature model (maturity gate not passed, 7 training rounds). Scores rank; they never assert a category.

Opus teacher head0.036
GPT teacher head0.245
Teacher spread0.209 · how far apart the two teachers sit on this one work
Validation statusscore_only:v0-immature-baseline · verbatim from the scoring run: score_only means the number may rank works, and no category label ships from it

Quick stats

Citations7
Published2023
Admission routes1
Has abstractyes

Explore more

Same topic3D IC and TSV technologiesFrench-language works237,207