JCISE Editorial Board—Year 2023

The Journal of Computing and Information Science in Engineering (JCISE) publishes articles related to scientific computing methods (e.g., modeling, simulation, representation, and algorithm) and computational tools (e.g., high-performance computing, and virtual and augmented reality) that aim to improve engineering products and systems for their complete lifecycle (e.g., design, manufacturing, operation, maintenance, disposal, and recycling). The interest areas include computational geometry, computer-aided design and manufacturing, cyber-physical systems, human–machine interface, machine intelligence, machine learning, modeling and simulation, precision engineering, product lifecycle management, reverse engineering, and systems engineering.Yan Wang, Georgia Institute of Technology, USAGaurav Ameta, Siemens Corporate Technology, USANabil Anwer, Ecole Normale Superieure Paris-Sarclay, FranceStephen Baek, University of Virginia, USAWilliam Bernstein, Air Force Research Laboratory, USALinkan Bian, Mississippi State University, USAMatthew I. Campbell, Oregon State University, USASeung-Kyum Choi, Georgia Institute of Technology, USAChih-Hsing Chu, National Tsing Hua University, TaiwanJonathan Roy Corney, University of Edinburgh, UKEhsan Esfahani, State University of New York at Buffalo, USAFrancesco Ferrise, Politecnico di Milano, ItalyAmir H. Gandomi, University of Technology Sydney, AustraliaJohann Guilleminot, Duke University, USAB. Gurumoorthy, Indian Institute of Science, IndiaBin He, Shanghai University, ChinaAjay Joneja, Hong Kong University of Science and Technology, Hong KongKrishnanand Kaipa, Old Dominion University, USAAshok V. Kumar, University of Florida, USATsz-Ho Kwok, Concordia University, CanadaGuang Lin, Purdue University, USAYing Liu, Cardiff University, UKYusheng Liu, Zhejiang University, ChinaYan Lu, National Institute of Standards and Technology, USAJianxi Luo, Singapore University of Technology and Design, SingaporeYongsheng Ma, Southern University of Science and Technology, ChinaMahesh Mani, National Institute of Standards and Technology, USAJohn G. Michopoulos, Naval Research Laboratory, USADuhwan Mun, Korea University, South KoreaAlison Olechowski, University of Toronto, CanadaYayue Pan, University of Illinois at Chicago, USAAnurag Purwar, Stony Brook University, USARahul Rai, Clemson University, USAP.V.M. Rao, Indian Institute of Technology Delhi, IndiaCaterina Rizzi, University of Bergamo, ItalyKazuhiro Saitou, University of Michigan, USAShana Smith, National Taiwan University, TaiwanYu Song, Delft University of Technology, The NetherlandsKrishnan Suresh, University of Wisconsin, Madison, USAAtul Thakur, Indian Institute of Technology Patna, IndiaDouglas Van Bossuyt, Naval Postgraduate School, USACharlie C. L. Wang, University of Manchester, UKJun Wang, Nanjing University of Aeronautics and Astronautics, ChinaKristina Wärmefjord, Chalmers University of Technology, SwedenHui Yang, Pennsylvania State University, USAZhinan Zhang, Shanghai Jiao Tong University, ChinaVinayak Raman Krishnamurthy, Texas A&M University, USAJami J. Shah (Founding Editor-in-Chief), Ohio State University, USABahram Ravani (Former Editor-in-Chief), University of California, Davis, USASatyandra K. Gupta (Former Editor-in-Chief), University of Southern California, USAJanet Allen, University of Oklahoma, USASanjay Govind Dhande, Indian Institute of Technology Kanpur, IndiaImre Horváth, Delft University of Technology, The NetherlandsRam D. Sriram, National Institute of Standards and Technology, USAJianrong Tan, Zhejiang University, ChinaAnindya Bhaduri, General Electric Research, USABopaya Bidanda, University of Pittsburgh, USASatish Bukkapatnam, Texas A&M University, USAStephen Canfield, Tennessee Technological University, USAFrancisco Chinesta, ENSAM Institute of Technology, FranceElias Cueto, University of Zaragoza, SpainKaushal Desai, Indian Institute of Technology Jodhpur, IndiaLiang Gao, Huazhong University of Science and Technology, ChinaAkhil Garg, Huazhong University of Science and Technology, ChinaZhaohui Geng, Ohio University, USADan Li, Clemson University, USAChenang Liu, Oklahoma State University, USADehao Liu, Binghamton University, USAJie Liu, Carleton University, CanadaJunfeng Ma, Mississippi State University, USAMarc Mignolet, Arizona State University, USAZhenguo Nie, Tsinghua University, ChinaZhou Quan, University of Birmingham, UKSandipp Krishnan Ravi, General Electric Research, USAChristian Soize, Université Gustave Eiffel, FranceZiyou Song, National University of Singapore, SingaporeWenmeng Tian, Mississippi State University, USAJian-Xun Wang, University of Notre Dame, USAPaul Witherell, National Institute of Standards and Technology, USAMark Yampolskiy, Auburn University, USAFan Zhang, Georgia Institute of Technology, USAYunbo Zhang, Rochester Institute of Technology, USAAmy Suski

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