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Record W4392254676 · doi:10.4071/001c.91170

Improving Reliability of Fan -Out Wafer Level Package Through Doping of Lead-Free Solder Balls

2023· article· en· W4392254676 on OpenAlex

Why this work is in the frame

A frame that forgets how it found something cannot be audited. These are the routes that admitted this work.

affAt least one author lists a Canadian institution in the pinned OpenAlex snapshot.

Bibliographic record

VenueIMAPSource Proceedings · 2023
Typearticle
Languageen
FieldEngineering
TopicElectronic Packaging and Soldering Technologies
Canadian institutionsInfineon Technologies (Canada)
Fundersnot available
KeywordsBall grid arrayTemperature cyclingMaterials scienceWaferDopingSolderingComposite materialThermal resistanceFailure mode and effects analysisPrinted circuit boardOptoelectronicsBall (mathematics)Electrical engineeringThermalEngineering

Abstract

fetched live from OpenAlex

Embedded wafer level ball grid array (eWLB) or FO-WLP (Fan-out wafer-level packaging) is investigated as a package for MMICs (Monolithic Microwave Integrated Circuit) for automotive radar applications in the 77GHz range. Doping of Bi and/or Sb was applied to improve the resistance of lead-free SAC balls against thermal cycling stress. We have shown that by increasing the doping level the lifetime can be increased and determined the maximum doping level before extrinsic failure modes dominate. It is well-known from the literature that doping of Bi and/or Sb improves the resistance of lead-free SAC balls against thermal cycling stress. It was shown that lifetime of FC-BGA package can be multiplied using Bi and/or Sb doping. The lifetime gain is achieved by reduced creepage of the hardened balls caused by the doping. This reduced creepage increases the risk of causing other failures than ball cracks in the eWLB package or the PCB during thermal cycling stress. We have tested robustness of 7x8,5 mm^2 eWLB packages against thermal cycling stress T = -40 to 125 °C using SAC-balls with different Bi-doping content from 0% to 2,5% Bi concentration. As could be expected the solder ball fatigue mode is delayed more and more increasing the Bi content. We found other failure modes than solder ball fatigue emerging at doping around 1%. The fatigue modes are shifted towards cupper lines on PCB or into the package. Cu line cracks can be overcome by switching the PCB layout from NSMD (non solder-mask defined) to SMD (solder-mask defined) solder pads. In general there is a lifetime penalty when switching from NSMD to SMD, but by avoiding the Cu line cracks this lifetime loss is overcompensated using SMD pads for optimum performance. As input for simulations we have characterized the doped solder material using specimens produced in glass columns. We have also tested the components on PCBs with different top layer laminate with different CTE and elastic modulus to assess the influence of the PCB properties on the lifetime. It is a trend in automotive radar systems to use stiffer laminates which are cheaper but have negative influence on component lifetime. Solder ball shear tests were also carried out to characterize the influence of ball doping on other board-level reliability beyond thermal cycling performance. As expected ball shear force is increased with increased doping level. At increased shear-force the shearing is still done through the solder ball and does not lead to different shear-mode. Finally drop-tests were done to check influence of doping on board-level reliability performance other than thermal-cycling performance.

Fetched live from OpenAlex and de-inverted. Abstracts are not stored in this database: the inverted indexes are 8.6 GB of the frame’s 9.3 GB of text, and the host has 13 GB free.

Full frame distilled prediction

Teacher imitation

Not calibrated prevalence, not ground truth. Human validation pending. Learned from the 10,348 direct Codex labels and 10,348 direct Gemma labels. Candidate is the union of thresholded teacher heads; consensus is their intersection. These outputs are machine_predicted_unvalidated and are not human labels or direct frontier model labels.

metaresearch head score (Codex)0.000
metaresearch head score (Gemma)0.001
Version: codex-gemma-dda1882f352aValidation status: machine_predicted_unvalidated
Candidate categoriesMeta-epidemiology (narrow)
Consensus categoriesnone
DomainCandidate signal: none · Consensus signal: none
Study designCandidate signal: Bench or experimental · Consensus signal: Bench or experimental
GenreCandidate signal: Empirical · Consensus signal: Empirical
Teacher disagreement score0.012
Threshold uncertainty score1.000

Codex and Gemma teacher scores by category

CategoryCodexGemma
Metaresearch0.0000.001
Meta-epidemiology (narrow)0.0000.000
Meta-epidemiology (broad)0.0000.000
Bibliometrics0.0000.001
Science and technology studies0.0000.000
Scholarly communication0.0000.000
Open science0.0010.000
Research integrity0.0000.000
Insufficient payload (model declined to judge)0.0000.000

Machine scores (provisional)

The two teacher heads of the student model, read on this work. A score orders the frame for review; it never asserts a category, and the validation status ships verbatim with every row.

Baseline scores from an immature model (maturity gate not passed, 7 training rounds). Scores rank; they never assert a category.

Opus teacher head0.027
GPT teacher head0.241
Teacher spread0.214 · how far apart the two teachers sit on this one work
Validation statusscore_only:v0-immature-baseline · verbatim from the scoring run: score_only means the number may rank works, and no category label ships from it