MétaCan
Menu
Back to cohort
Record W4416880004 · doi:10.37665/jsmtwtpss47010

Process Optimization for 1.0 mm Pitch CBGA

2000· article· W4416880004 on OpenAlexaff
Marie Cole, Richard Duchesne, Mario Interrante, Lisa Jimarez, Grégory Martin

Bibliographic record

VenueJournal of Surface Mount Technology · 2000
Typearticle
Language
FieldEngineering
TopicElectronic Packaging and Soldering Technologies
Canadian institutionsIBM (Canada)
Fundersnot available
KeywordsInterconnectionBall grid arraySurface-mount technologyPrinted circuit boardSolderingIntegrated circuit packagingCeramicIntegrated circuitChip-scale packageRanging

Abstract

fetched live from OpenAlex

ABSTRACT The ceramic ball grid array (CBGA) package is used today in a wide range of applications because of its many advantages: high interconnection density; compatibility with standard surface mount technology (SMT) assembly techniques; excellent thermal and electrical performance; and high interconnectivity. Todayís CBGA applications include memory, logic, and microprocessors, and they are found in computer systems ranging from desktop to mainframe with highest usage in work station and server applications. As these applications, particularly the high-end work stations and network servers, demand greater numbers of interconnections, increasing the interconnection density is one means of providing a solution. Decreasing the interconnection pitch on the CBGA package from the typical 1.27 mm to 1.0 mm gives a corresponding increase in interconnection density. This increased density reduces the package body size for the same number of interconnections. For instance, 937 I/O are available on a 32.5 mm package with 1.0 mm pitch, instead of a 42.5 mm package with 1.27 mm pitch (1088 I/O). The smaller body size conserves area on the printed circuit board, but the tighter pitch requires more advanced printed circuit board (PCB) groundrules. The smaller body size, with its reduced distance to neutral point (DNP), should improve the reliability on a per interconnection basis, although the advantage is tempered by a reduction in solder joint height due to a smaller solder ball. The appropriate geometries and process parameters must be chosen, however, for optimum manufacturing yield and reliability. This paper will discuss the process development activities and experiments to determine the optimum structure for the 1.0 mm pitch CBGA package. Elements included in the evaluation are: printed circuit board groundrules, ball diameter and attach processing, solder volumes and other card assembly parameters, and card assembly rework processing. Both yield and reliability are considered in choosing the optimum structure and processes.

Fetched live from OpenAlex and de-inverted. Abstracts are not stored in this database: the inverted indexes are 8.6 GB of the frame’s 9.3 GB of text, and the host has 13 GB free.

How this classification was reachedexpand

Full frame machine prediction

Teacher imitation

Not calibrated prevalence, not ground truth. Human validation pending. The Gemma side is a direct model label for every work in the frame, read from the title-only record. The Codex side is a classifier learned from the 10,348 direct Codex labels and calibrated to design-weighted sample rates; fields without enough sample support carry no Codex call. Candidate is the union of the two sides; consensus is their intersection. These outputs are machine_predicted_unvalidated and are not human labels.

metaresearch head score (Codex)0.000
metaresearch head score (Gemma)0.001
Version: metacan-v3-hybrid-931329e0061cValidation status: machine_predicted_unvalidated
Candidate categoriesnone
Consensus categoriesnone
DomainCandidate signal: none · Consensus signal: none
Study designCandidate signal: Bench or experimental · Consensus signal: Bench or experimental
GenreCandidate signal: Empirical · Consensus signal: Empirical
Teacher disagreement score0.003
Threshold uncertainty score0.012

Distilled classifier scores by category (both heads)

CategoryCodexGemma
Metaresearch0.0000.001
Meta-epidemiology (narrow)0.0010.000
Meta-epidemiology (broad)0.0010.001
Bibliometrics0.0010.001
Science and technology studies0.0000.000
Scholarly communication0.0010.001
Open science0.0010.000
Research integrity0.0010.001
Insufficient payload (model declined to judge)0.0030.001

Machine scores (provisional)

The two teacher heads of the student model, read on this work. A score orders the frame for review; it never asserts a category, and the validation status ships verbatim with every row.

Baseline scores from an immature model (maturity gate not passed, 7 training rounds). Scores rank; they never assert a category.

Opus teacher head0.008
GPT teacher head0.245
Teacher spread0.236 · how far apart the two teachers sit on this one work
Validation statusscore_only:v0-immature-baseline · verbatim from the scoring run: score_only means the number may rank works, and no category label ships from it

Classification

machine, unvalidated

Machine predicted; a candidate call from one source (direct Gemma or distilled Codex), not a consensus.

The models applied no category: nothing in the taxonomy fit this work.
Study designBench or experimental
Domainnot available
GenreEmpirical

How this classification was reached, model by model and score by score, is at the end of the page under "How this classification was reached".

Quick stats

Citations0
Published2000
Admission routes1
Has abstractyes

Explore more

Same venueJournal of Surface Mount TechnologySame topicElectronic Packaging and Soldering TechnologiesFrench-language works237,207