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Record W4416880457 · doi:10.37665/jsmtsaclf86681

New Generation of Pb-Free Solder Alloys: Possible Solution to Solve Current Issues with Main Stream Pb-Free Soldering

2012· article· W4416880457 on OpenAlexaff
Polina Snugovsky, Simin Bagheri, Marianne Romansky, Doug D. Perovic, L. Snugovsky, J. W. Rutter

Bibliographic record

VenueJournal of Surface Mount Technology · 2012
Typearticle
Language
FieldEngineering
TopicElectronic Packaging and Soldering Technologies
Canadian institutionsUniversity of Toronto
Fundersnot available
KeywordsSolderingBall grid arrayWhiskerSolder pastePrinted circuit boardReflow solderingBismuthAlloy

Abstract

fetched live from OpenAlex

ABSTRACT Conversion to RoHS-compliant Pb-free assembly has proved to be a considerable challenge to the electronics assembly industry due to the higher reflow process temperature requirements of main stream Sn-Ag-Cu (SAC) alloys. This higher temperature can thermally damage the PCB and components. High Tg board materials used with the main stream Pb-free solder SAC305 are prone to Pad Cratering. The higher cost of soldering materials has also become a concern as the result of the continuously rising cost of silver (Ag), one of the main constituents of conventional SAC305 alloy. One possible solution to all the current SAC process shortcomings is to use alternative Pb-free solders with lower process temperatures. The lower process temperatures would allow the use of standard board laminate materials which have a lower propensity to “pad cratering” failures. It will also reduce the risk of damaging temperature-sensitive components (TSC). This paper is focused on solder alloys selection for an assembly process temperature in a range of 220 to 226°C, which is comparable to SnPb soldering process parameters. The methodology of alloy selection is discussed. Several ternary and quaternary Sn-based alloys containing Ag and/or copper (Cu), and bismuth (Bi) are proposed for further reliability studies of primary attached and reworked leaded, leadless and ball grid array components. The Bi addition reduces the melting temperature and improves thermo mechanical properties. An additional benefit of using Bi-containing solder alloys is the possibility to reduce the propensity of whisker growth. The alloys containing Bi were not used in recent studies due to the formation of the low melting Sn-Pb-Bi eutectic with SnPb components. As the supply chain has transitioned component finishes away from those containing lead in the last decade, the time has come where the use of Bi-containing alloys is no longer a reliability risk, and may indeed provide significant benefits to product field reliability

Fetched live from OpenAlex and de-inverted. Abstracts are not stored in this database: the inverted indexes are 8.6 GB of the frame’s 9.3 GB of text, and the host has 13 GB free.

How this classification was reachedexpand

Full frame machine prediction

Teacher imitation

Not calibrated prevalence, not ground truth. Human validation pending. The Gemma side is a direct model label for every work in the frame, read from the title-only record. The Codex side is a classifier learned from the 10,348 direct Codex labels and calibrated to design-weighted sample rates; fields without enough sample support carry no Codex call. Candidate is the union of the two sides; consensus is their intersection. These outputs are machine_predicted_unvalidated and are not human labels.

metaresearch head score (Codex)0.000
metaresearch head score (Gemma)0.000
Version: metacan-v3-hybrid-931329e0061cValidation status: machine_predicted_unvalidated
Candidate categoriesnone
Consensus categoriesnone
DomainCandidate signal: none · Consensus signal: none
Study designCandidate signal: Not applicable · Consensus signal: none
GenreCandidate signal: Empirical · Consensus signal: none
Teacher disagreement score0.002
Threshold uncertainty score0.008

Distilled classifier scores by category (both heads)

CategoryCodexGemma
Metaresearch0.0000.000
Meta-epidemiology (narrow)0.0010.000
Meta-epidemiology (broad)0.0010.000
Bibliometrics0.0010.000
Science and technology studies0.0000.000
Scholarly communication0.0010.001
Open science0.0010.000
Research integrity0.0010.000
Insufficient payload (model declined to judge)0.0020.001

Machine scores (provisional)

The two teacher heads of the student model, read on this work. A score orders the frame for review; it never asserts a category, and the validation status ships verbatim with every row.

Baseline scores from an immature model (maturity gate not passed, 7 training rounds). Scores rank; they never assert a category.

Opus teacher head0.025
GPT teacher head0.263
Teacher spread0.237 · how far apart the two teachers sit on this one work
Validation statusscore_only:v0-immature-baseline · verbatim from the scoring run: score_only means the number may rank works, and no category label ships from it

Classification

machine, unvalidated

Machine predicted; a candidate call from one source (direct Gemma or distilled Codex), not a consensus.

The models applied no category: nothing in the taxonomy fit this work.
Study designNot applicable
Domainnot available
GenreEmpirical

How this classification was reached, model by model and score by score, is at the end of the page under "How this classification was reached".

Quick stats

Citations0
Published2012
Admission routes1
Has abstractyes

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