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Record W4416880815 · doi:10.37665/smitwjh96163

Design and Process Effects on the Reliability of 1.0 mm Pitch CBGA

2000· article· W4416880815 on OpenAlex

Why this work is in the frame

A frame that forgets how it found something cannot be audited. These are the routes that admitted this work.

affAt least one author lists a Canadian institution in the pinned OpenAlex snapshot.

Bibliographic record

VenueSMTA International · 2000
Typearticle
Language
FieldEngineering
TopicElectronic Packaging and Soldering Technologies
Canadian institutionsIBM (Canada)
Fundersnot available
KeywordsBall grid arrayInterconnectionPrinted circuit boardSurface-mount technologySolderingCeramicPackage on packageIntegrated circuit packagingBall (mathematics)

Abstract

fetched live from OpenAlex

ABSTRACT The ceramic ball grid array (CBGA) package is used today in a wide range of applications, because of its many advantages: high interconnection density; compatibility with standard surface mount technology (SMT) assembly techniques; excellent thermal and electrical performance; and high interconnectivity. Today's CBGA applications include memory, logic, and microprocessors and are found in computer systems ranging from desktop to mainframe, with highest usage in work station and server applications. Advances in printed circuit board technology and card assembly processing have enabled the implementation of the finer pitch CBGA packages that are in demand to meet the needs of increasing interconnect density. CBGA packages with a 1.0 mm pitch ball array have been recently qualified and are now shipping to several customers for a variety of applications. The most common sizes and ball counts are 25 mm with 552 I/O, 25×32.5 mm with 720 I/O and 32.5 mm with 937 I/O. Initial qualification activities focused on the basic groundrules, dimensions and processing - such as the printed circuit board pad size, the substrate pad diameter, the solder ball diameter and the card assembly solder volume. As the technology is implemented and begins production, it becomes important to understand additional factors that can effect the solder joint thermal fatigue life. This paper will discuss the evaluation of many design and process factors that can effect the interconnect reliability. Design factors investigated include the thickness of the ceramic substrate, the depopulation of corner ball locations, and the option of a Direct Lid Attach (DLA) lid. Process factors that have continued to be investigated include the card assembly solder volume, the card assembly reflow profile, and the card assembly rework process

Fetched live from OpenAlex and de-inverted. Abstracts are not stored in this database: the inverted indexes are 8.6 GB of the frame’s 9.3 GB of text, and the host has 13 GB free.

Full frame distilled prediction

Teacher imitation

Not calibrated prevalence, not ground truth. Human validation pending. Learned from the 10,348 direct Codex labels and 10,348 direct Gemma labels. Candidate is the union of thresholded teacher heads; consensus is their intersection. These outputs are machine_predicted_unvalidated and are not human labels or direct frontier model labels.

metaresearch head score (Codex)0.000
metaresearch head score (Gemma)0.000
Version: codex-gemma-dda1882f352aValidation status: machine_predicted_unvalidated
Candidate categoriesnone
Consensus categoriesnone
DomainCandidate signal: none · Consensus signal: none
Study designCandidate signal: Simulation or modeling · Consensus signal: none
GenreCandidate signal: Empirical · Consensus signal: Empirical
Teacher disagreement score0.483
Threshold uncertainty score0.617

Codex and Gemma teacher scores by category

CategoryCodexGemma
Metaresearch0.0000.000
Meta-epidemiology (narrow)0.0000.000
Meta-epidemiology (broad)0.0000.000
Bibliometrics0.0000.000
Science and technology studies0.0000.000
Scholarly communication0.0000.000
Open science0.0000.000
Research integrity0.0000.000
Insufficient payload (model declined to judge)0.0000.000

Machine scores (provisional)

The two teacher heads of the student model, read on this work. A score orders the frame for review; it never asserts a category, and the validation status ships verbatim with every row.

Baseline scores from an immature model (maturity gate not passed, 7 training rounds). Scores rank; they never assert a category.

Opus teacher head0.010
GPT teacher head0.235
Teacher spread0.226 · how far apart the two teachers sit on this one work
Validation statusscore_only:v0-immature-baseline · verbatim from the scoring run: score_only means the number may rank works, and no category label ships from it