Strain engineering in III-V photonic components through structuration of SiNx films

We describe work to quantify the effects of structured dielectric thin films, such as SiNx, at the surface of III-V semiconductors, in terms of strain engineering with applications to photonic components such as waveguides and lasers. We show that the strain in the semiconductor can be engineered by controlling the stress in the dielectric thin film by tuning its deposition process. In the first part of this study, we describe how we can control the amount of this built-in mechanical stress, in the case of SiNx, over a large range, from highly tensile (300 MPa) to highly compressive (−800 MPa), using two different kinds of plasma-enhanced chemical vapor deposition reactors: a standard capacitively coupled reactor with radiofrequency excitation and an electron cyclotron resonance reactor with microwave excitation. We focused on characterizing and understanding these thin films' optical and chemical bonding properties through spectroscopic ellipsometry and Fourier transform infrared spectroscopy. We have also studied their mechanical properties experimentally using the wafer curvature measurement technique, microstructure fabrication, and nanoindentation measurements. In the second part, we show accurate measurements of the strain distribution induced within GaAs wafers when such thin films are structured in the shape of elongated stripes of variable width, using standard optical lithography and plasma etching. For this, we map the anisotropic deformation, measuring the degree of polarization of the spectrally integrated photoluminescence (PL) generated within GaAs by excitation with a red laser. PL from the bulk cubic semiconductors such as GaAs and InP is unpolarized, whereas anisotropic strain produces some degree of polarization. These maps were measured either from the semiconductor surface or from cleaved cross sections. They provide a detailed and complete image of the crystal deformation in the vicinity of the structured stressor film. Finally, we have performed some finite element simulations trying to reproduce the experimental maps. This investigation covering the different steps, including control of the built-in stress within the SiNx thin films, mapping of the anisotropic deformation field generated within the semiconductor beneath the structured films, and numerical simulation of these effects, allows us to propose a set of recipes that can be employed for strain engineering of III-V photonic components. Our simulation scheme is helpful for the design of the photonic components, e.g., to predict the local changes in the refractive index due to the photoelastic effect.

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