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Record W2015729901 · doi:10.1109/eptc.2012.6507164

Simulation approach to improving BGA reliability on coreless packages

2012· article· en· W2015729901 on OpenAlexaff
Cheryl Selvanayagam, Rathin Mandal

Bibliographic record

Venuenot available
Typearticle
Languageen
FieldEngineering
TopicElectronic Packaging and Soldering Technologies
Canadian institutionsAdvanced Micro Devices (Canada)
Fundersnot available
KeywordsBall grid arrayReliability (semiconductor)Flip chipEngineeringMechanical engineeringFinite element methodIntegrated circuit packagingReliability engineeringStructural engineeringElectronic engineeringIntegrated circuitElectrical engineeringSolderingMaterials sciencePower (physics)Layer (electronics)Composite material

Abstract

fetched live from OpenAlex

With the increased popularity of ultra-portable electronics such as laptops, microprocessor manufacturers have had to move away from the conventional and highly reliable pin-grid array (PGA) packages and towards ball-grid array (BGA) packages for this market segment due to thickness restrictions. This shift brings with it some reliability concerns. In addition, to shrink the form factor and improve electrical performance further, standard-core substrates are being swapped for thin-core and coreless variations. This work evaluates BGA performance of flip-chip packages with coreless substrates through finite element analysis (FEA) simulation. A three-dimensional quarter-model of a package with no heat spreader on coreless substrate with mixed BGA pitch was used so the location of expected failure can be simulated more accurately. This work then proposes a methodology for improving BGA reliability of coreless packages. Taking into account the behavior of coreless BGA packages, it is proposed that one possible method to improve BGA life in these packages would be to convert the few critical joints to dummy (power/ground plane) joints such that failure of the critical die corner joints does not result in failure of the part. This can be implemented by a design rule that stipulates the replacement of critical die corner joints with dummy joints in coreless substrates. We determined expected percentage improvement in BGA life with the implementation of such a design rule using FEA simulations and Miner's rule: for the BGA layout assumed here, results indicate that 130% improvement in BGA life is possible when five solder joints at the die corner are replaced with dummy joints. This work will be useful for robust design of solder joints in BGA packages with coreless substrates.

Fetched live from OpenAlex and de-inverted. Abstracts are not stored in this database: the inverted indexes are 8.6 GB of the frame’s 9.3 GB of text, and the host has 13 GB free.

How this classification was reachedexpand

Full frame distilled prediction

Teacher imitation

Not calibrated prevalence, not ground truth. Human validation pending. Learned from the 10,348 direct Codex labels and 10,348 direct Gemma labels. Candidate is the union of thresholded teacher heads; consensus is their intersection. These outputs are machine_predicted_unvalidated and are not human labels or direct frontier model labels.

metaresearch head score (Codex)0.000
metaresearch head score (Gemma)0.000
Version: codex-gemma-dda1882f352aValidation status: machine_predicted_unvalidated
Candidate categoriesnone
Consensus categoriesnone
DomainCandidate signal: none · Consensus signal: none
Study designCandidate signal: Simulation or modeling · Consensus signal: Simulation or modeling
GenreCandidate signal: Empirical · Consensus signal: Empirical
Teacher disagreement score0.213
Threshold uncertainty score0.439

Codex and Gemma teacher scores by category

CategoryCodexGemma
Metaresearch0.0000.000
Meta-epidemiology (narrow)0.0000.000
Meta-epidemiology (broad)0.0000.000
Bibliometrics0.0000.000
Science and technology studies0.0000.000
Scholarly communication0.0000.000
Open science0.0000.000
Research integrity0.0000.000
Insufficient payload (model declined to judge)0.0000.000

Machine scores (provisional)

The two teacher heads of the student model, read on this work. A score orders the frame for review; it never asserts a category, and the validation status ships verbatim with every row.

Baseline scores from an immature model (maturity gate not passed, 7 training rounds). Scores rank; they never assert a category.

Opus teacher head0.018
GPT teacher head0.238
Teacher spread0.220 · how far apart the two teachers sit on this one work
Validation statusscore_only:v0-immature-baseline · verbatim from the scoring run: score_only means the number may rank works, and no category label ships from it

Classification

machine, unvalidated

Machine predicted; a candidate call from one teacher head, not a consensus.

The models applied no category: nothing in the taxonomy fit this work.
Study designSimulation or modeling
Domainnot available
GenreEmpirical

How this classification was reached, model by model and score by score, is at the end of the page under "How this classification was reached".

Quick stats

Citations1
Published2012
Admission routes1
Has abstractyes

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