Resistivity of thin Cu films coated with Ta, Ti, Ru, Al, and Pd barrier layers from first principles
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Bibliographic record
Abstract
We present an atomistic first-principles calculation for the resistivity of rough Cu thin films coated with barrier layers of Ta, Ti, Ru, Al, and Pd. A significant difference in resistivity due to different barrier metals is found. Ti, Ta, and Ru barriers increase the resistivity whereas Al and Pd lower the resistivity, in comparison with that of bare Cu films having the same degree of roughness disorder. It is found that Al/Pd barrier atoms produce density of states (DOS) that match rather well with the DOS of Cu atoms on a Cu film with a perfectly flat surface while the DOS of Ti, Ta, and Ru do not match. Our results suggest that the geometrical roughness on the Cu film that causes diffuse scattering, can be ``smoothed'' out electronically by certain barriers such that the surface scattering becomes more specular.
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Teacher imitationNot calibrated prevalence, not ground truth. Human validation pending. Learned from the 10,348 direct Codex labels and 10,348 direct Gemma labels. Candidate is the union of thresholded teacher heads; consensus is their intersection. These outputs are machine_predicted_unvalidated and are not human labels or direct frontier model labels.
Codex and Gemma teacher scores by category
| Category | Codex | Gemma |
|---|---|---|
| Metaresearch | 0.000 | 0.001 |
| Meta-epidemiology (narrow) | 0.000 | 0.000 |
| Meta-epidemiology (broad) | 0.000 | 0.000 |
| Bibliometrics | 0.000 | 0.000 |
| Science and technology studies | 0.000 | 0.000 |
| Scholarly communication | 0.000 | 0.000 |
| Open science | 0.000 | 0.000 |
| Research integrity | 0.000 | 0.000 |
| Insufficient payload (model declined to judge) | 0.001 | 0.000 |
Machine scores (provisional)
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Baseline scores from an immature model (maturity gate not passed, 7 training rounds). Scores rank; they never assert a category.
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