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Record W2146393746 · doi:10.1109/tepm.2005.863266

Characteristics of Sn–Cu Solder Bump Formed by Electroplating for Flip Chip

2006· article· en· W2146393746 on OpenAlex

Why this work is in the frame

A frame that forgets how it found something cannot be audited. These are the routes that admitted this work.

affAt least one author lists a Canadian institution in the pinned OpenAlex snapshot.

Bibliographic record

VenueIEEE Transactions on Electronics Packaging Manufacturing · 2006
Typearticle
Languageen
FieldEngineering
TopicElectronic Packaging and Soldering Technologies
Canadian institutionsUniversity of Waterloo
Fundersnot available
KeywordsElectroplatingFlip chipPlating (geology)Materials scienceSolderingSubstrate (aquarium)Analytical Chemistry (journal)MetallurgyPhysicsNanotechnologyChemistryChromatographyAdhesive

Abstract

fetched live from OpenAlex

Sn–Cu near eutectic solder bump was fabricated by electroplating for flip-chip, and its electroplating and bump characteristics were studied. A Si-wafer was used as a substrate and the under bump metallization (UBM) comprised 400 nm of Al, 300 nm of Cu, 400 nm of Ni, and 20 nm of Au sequentially from bottom to the top of the metallization. The electrolyte for plating Sn–Cu solder consisted of <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$hbox Sn^+2$</tex> (concentration of 30 g/L) and <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$hbox Cu^+2$</tex> (0.3 g/L) solutions with methasulfonic acid and deionized water. The experimental results showed that the plating ratio of the Sn–Cu increased from 0.25 to 2.7 <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$mu/hbox min$</tex> with increasing current density from 1 to 8 <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$hbox A/dm^2$</tex> . In this range of current density, the plated Sn–Cu maintained its composition nearly constant level as Sn-(0.9 <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$sim$</tex> 1.4)wt% Cu. The solder bump of typical mushroom shape with 120- <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$muhbox m$</tex> stem diameter and 75- <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$muhbox m$</tex> height was formed by plating at 5 <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$hbox A/dm^2$</tex> for 2 h. The mushroom bump changed its shape to the hemispherical type of 140- <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$muhbox m$</tex> diameter by air reflow on a hot plate at 260 <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$^circhbox C$</tex> . The homogeneity of element distribution in the solder bump was examined, and Sn content in the mushroom bump appears to be uneven changed to more uniform after the air reflow. The highest shear bond strength of the Sn–Cu hemispherical bump showed 113 gf by reflowing at 260 <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$^circhbox C$</tex> for 10 s.

Fetched live from OpenAlex and de-inverted. Abstracts are not stored in this database: the inverted indexes are 8.6 GB of the frame’s 9.3 GB of text, and the host has 13 GB free.

Full frame distilled prediction

Teacher imitation

Not calibrated prevalence, not ground truth. Human validation pending. Learned from the 10,348 direct Codex labels and 10,348 direct Gemma labels. Candidate is the union of thresholded teacher heads; consensus is their intersection. These outputs are machine_predicted_unvalidated and are not human labels or direct frontier model labels.

metaresearch head score (Codex)0.000
metaresearch head score (Gemma)0.000
Version: codex-gemma-dda1882f352aValidation status: machine_predicted_unvalidated
Candidate categoriesMeta-epidemiology (narrow)
Consensus categoriesnone
DomainCandidate signal: none · Consensus signal: none
Study designCandidate signal: Bench or experimental · Consensus signal: Bench or experimental
GenreCandidate signal: Empirical · Consensus signal: Empirical
Teacher disagreement score0.497
Threshold uncertainty score1.000

Codex and Gemma teacher scores by category

CategoryCodexGemma
Metaresearch0.0000.000
Meta-epidemiology (narrow)0.0010.001
Meta-epidemiology (broad)0.0010.000
Bibliometrics0.0000.000
Science and technology studies0.0000.000
Scholarly communication0.0000.000
Open science0.0000.000
Research integrity0.0000.001
Insufficient payload (model declined to judge)0.0000.000

Machine scores (provisional)

The two teacher heads of the student model, read on this work. A score orders the frame for review; it never asserts a category, and the validation status ships verbatim with every row.

Baseline scores from an immature model (maturity gate not passed, 7 training rounds). Scores rank; they never assert a category.

Opus teacher head0.006
GPT teacher head0.200
Teacher spread0.194 · how far apart the two teachers sit on this one work
Validation statusscore_only:v0-immature-baseline · verbatim from the scoring run: score_only means the number may rank works, and no category label ships from it