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Record W2171570210 · doi:10.1109/ccece.2004.1345075

Thermo-mechanical stress analysis of VLSI devices by partially coupled finite element method

2004· article· en· W2171570210 on OpenAlexaff
Mohammed Bougataya, A. Lakhsasi, Yvon Savaria, Daniel Massicotte

Bibliographic record

Venuenot available
Typearticle
Languageen
FieldEngineering
TopicSilicon Carbide Semiconductor Technologies
Canadian institutionsUniversité du Québec à Trois-RivièresPolytechnique MontréalUniversité du Québec en Outaouais
Fundersnot available
KeywordsBall grid arrayFinite element methodHeat sinkHeat transferIntegrated circuitJunction temperatureMechanical engineeringMiniaturizationMaterials scienceElectronic engineeringPrinted circuit boardMicroelectronicsSemiconductor deviceComputer scienceThermalElectrical engineeringEngineeringSolderingMechanicsOptoelectronicsStructural engineering

Abstract

fetched live from OpenAlex

The impact of thermo-mechanical stress and distortion behavior is crucial during development of VLSI (very large scale integration) and WSI (wafer scale integration) circuits for their safe operation. The problem of the junction overheating and the thermal design aspect remains a major obstacle to the most required performances of electronic systems: increased speed of operation and component miniaturization. The design of a reliable large and powerful processor requires thermal analysis for the whole device of coupled fluid-heat transfer from junction to ambient. Device electro-thermal behavior is principally influenced by package geometry, junction structure, and physical heat sources distribution. The paper analyzes thermo-mechanical stress using a mixed fluid-heat transfer approach for thermal analysis and distortion behavior in large VLSI and WSI microelectronic devices by the partially coupled FEM (finite element method). The estimation of equivalent convection coefficient has become the major issue for device junction to ambient thermal analysis. Based on FEM, the approach combines fluid flow and heat transfer mechanisms to predict, in general, the working temperature of the IC (integrated circuit). A numerical example is given to demonstrate the critical behavior of a BGA (ball grid array) package. It concerns the steady state thermal stress and distortion modeling of semiconductor devices undergoing large power heating. The methodology presented can be used for accurate rating of semiconductor devices or heat sink systems during large ASIC (application specific integrated circuit) circuit design.

Fetched live from OpenAlex and de-inverted. Abstracts are not stored in this database: the inverted indexes are 8.6 GB of the frame’s 9.3 GB of text, and the host has 13 GB free.

How this classification was reachedexpand

Full frame machine prediction

Teacher imitation

Not calibrated prevalence, not ground truth. Human validation pending. The Gemma side is a direct model label for every work in the frame, read from the title-only record. The Codex side is a classifier learned from the 10,348 direct Codex labels and calibrated to design-weighted sample rates; fields without enough sample support carry no Codex call. Candidate is the union of the two sides; consensus is their intersection. These outputs are machine_predicted_unvalidated and are not human labels.

metaresearch head score (Codex)0.000
metaresearch head score (Gemma)0.001
Version: metacan-v3-hybrid-931329e0061cValidation status: machine_predicted_unvalidated
Candidate categoriesnone
Consensus categoriesnone
DomainCandidate signal: none · Consensus signal: none
Study designCandidate signal: Simulation or modeling · Consensus signal: Simulation or modeling
GenreCandidate signal: Empirical · Consensus signal: none
Teacher disagreement score0.003
Threshold uncertainty score0.006

Distilled classifier scores by category (both heads)

CategoryCodexGemma
Metaresearch0.0000.001
Meta-epidemiology (narrow)0.0010.000
Meta-epidemiology (broad)0.0010.001
Bibliometrics0.0010.000
Science and technology studies0.0000.000
Scholarly communication0.0010.000
Open science0.0010.000
Research integrity0.0010.000
Insufficient payload (model declined to judge)0.0020.000

Machine scores (provisional)

The two teacher heads of the student model, read on this work. A score orders the frame for review; it never asserts a category, and the validation status ships verbatim with every row.

Baseline scores from an immature model (maturity gate not passed, 7 training rounds). Scores rank; they never assert a category.

Opus teacher head0.016
GPT teacher head0.266
Teacher spread0.251 · how far apart the two teachers sit on this one work
Validation statusscore_only:v0-immature-baseline · verbatim from the scoring run: score_only means the number may rank works, and no category label ships from it

Classification

machine, unvalidated

Machine predicted; a candidate call from one source (direct Gemma or distilled Codex), not a consensus.

The models applied no category: nothing in the taxonomy fit this work.
Study designSimulation or modeling
Domainnot available
GenreEmpirical

How this classification was reached, model by model and score by score, is at the end of the page under "How this classification was reached".

Quick stats

Citations2
Published2004
Admission routes1
Has abstractyes

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