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Record W2743594127 · doi:10.1109/ectc.2017.84

Study of Capillary Underfill Filler Separation in Advanced Flip Chip Packages

2017· preprint· en· W2743594127 on OpenAlexaff
M.-C. Paquet, David Danovitch, Papa Momar Souaré, Julien Sylvestre

Bibliographic record

Venuenot available
Typepreprint
Languageen
FieldEngineering
TopicElectronic Packaging and Soldering Technologies
Canadian institutionsInstitut interdisciplinaire d'innovation technologiqueUniversité de SherbrookeIBM (Canada)
Fundersnot available
KeywordsFlip chipMaterials scienceFiller (materials)Composite materialSolderingCapillary actionContext (archaeology)Integrated circuit packagingWettingLayer (electronics)AdhesiveOptoelectronicsIntegrated circuit

Abstract

fetched live from OpenAlex

The key role that underfill materials play in highly reliable, advanced flip chip organic packages has generated an increased focus on their behavior and structure. One such behavior relates to the observation of filler separation from the resin matrix which, to date, has been predominantly attributed to gravity or capillary flow. The phenomenon of silica filler separation is discussed in the context of fine pitch, lead-free solder joints with copper-base (pedestal or pillar) under bump metallization and large die packages. The principle mechanism driving filler separation in these structures was confirmed as a migration of the electrostatically charged filler particles away from the copper regions and towards the solder regions of the interconnect. Based on this finding, various factors that influence the surface of the interconnects or the nature and the mobility of the filler particles during the bond and assembly process were explored. It was found that the oxide states and contact angles of the interconnect surfaces do not appear to impact the degree of filler separation. Within the range explored, average filler particle size is ineffective in changing the separation behavior. On the other hand, lower filler content somewhat increases the extent of separation and is believed to be related to an increase in particle mobility. Assembly process variables with known effects on surface interactions and underfill flow were also studied, revealing no observable shift in the occurrence of filler separation. Finally, and most importantly, a reliability study was conducted to investigate the impact of this phenomenon in a very large die (23 × 23 mm2) flip chip organic package subjected to a high level of thermomechanical stress. Using extended Deep Thermal Cycling to 2000 cycles (as opposed to the standard 1000 cycle criterion), no packaging failures occurred and no signs of interconnect degradation were observed. These results are consistent with finite element modeling of the tested package, which showed that stress changes from filler separation in regions of similar dimensions to those that were experimentally observed were within the limits of model error and typical manufacturing variability.

Fetched live from OpenAlex and de-inverted. Abstracts are not stored in this database: the inverted indexes are 8.6 GB of the frame’s 9.3 GB of text, and the host has 13 GB free.

How this classification was reachedexpand

Full frame distilled prediction

Teacher imitation

Not calibrated prevalence, not ground truth. Human validation pending. Learned from the 10,348 direct Codex labels and 10,348 direct Gemma labels. Candidate is the union of thresholded teacher heads; consensus is their intersection. These outputs are machine_predicted_unvalidated and are not human labels or direct frontier model labels.

metaresearch head score (Codex)0.000
metaresearch head score (Gemma)0.000
Version: codex-gemma-dda1882f352aValidation status: machine_predicted_unvalidated
Candidate categoriesMeta-epidemiology (narrow)
Consensus categoriesnone
DomainCandidate signal: none · Consensus signal: none
Study designCandidate signal: Simulation or modeling · Consensus signal: none
GenreCandidate signal: Empirical · Consensus signal: Empirical
Teacher disagreement score0.781
Threshold uncertainty score1.000

Codex and Gemma teacher scores by category

CategoryCodexGemma
Metaresearch0.0000.000
Meta-epidemiology (narrow)0.0000.000
Meta-epidemiology (broad)0.0000.000
Bibliometrics0.0000.000
Science and technology studies0.0000.000
Scholarly communication0.0000.000
Open science0.0000.000
Research integrity0.0000.001
Insufficient payload (model declined to judge)0.0000.000

Machine scores (provisional)

The two teacher heads of the student model, read on this work. A score orders the frame for review; it never asserts a category, and the validation status ships verbatim with every row.

Baseline scores from an immature model (maturity gate not passed, 7 training rounds). Scores rank; they never assert a category.

Opus teacher head0.030
GPT teacher head0.301
Teacher spread0.271 · how far apart the two teachers sit on this one work
Validation statusscore_only:v0-immature-baseline · verbatim from the scoring run: score_only means the number may rank works, and no category label ships from it

Classification

machine, unvalidated

Machine predicted; a candidate call from one teacher head, not a consensus.

Study designSimulation or modeling
Domainnot available
GenreEmpirical

How this classification was reached, model by model and score by score, is at the end of the page under "How this classification was reached".

Quick stats

Citations5
Published2017
Admission routes1
Has abstractyes

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