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Record W2895849029 · doi:10.1109/tcpmt.2018.2874241

Add-On Microchannels for Hotspot Thermal Management of Microelectronic Chips in Compact Applications

2018· article· en· W2895849029 on OpenAlexafffund
Louis-Michel Collin, Jean-Philippe Colonna, P. Coudrain, Mahmood R. S. Shirazy, S. Chéramy, A. Souifi, Luc G. Fréchette

Bibliographic record

VenueIEEE Transactions on Components Packaging and Manufacturing Technology · 2018
Typearticle
Languageen
FieldEngineering
TopicHeat Transfer and Optimization
Canadian institutionsInstitut interdisciplinaire d'innovation technologiqueUniversité de Sherbrooke
FundersNatural Sciences and Engineering Research Council of CanadaCentre National de la Recherche ScientifiqueAgence Nationale de la Recherche
KeywordsMicroelectronicsMicrochannelChipMaterials scienceHeat fluxVolumetric flow rateMechanical engineeringElectrical engineeringOptoelectronicsNanotechnologyHeat transferMechanicsPhysicsEngineering

Abstract

fetched live from OpenAlex

This paper demonstrates an experimental micro- channel solution to cool microelectronic chips with hotspots, using an integrated, yet nonintrusive technique. In microelectronics, approaches such as die thinning induce acute stress on cooling because it increases the hotspot phenomena and reduces chip bulk thickness that could be used for microchannels. In compact devices, heat must be removed using limited pumping power and cooling space. Microchannels etched in the backside of the chip, usually considered as an efficient cooling solution, are impracticable on highly thinned chips. This paper experimentally investigates the cooling performance of a noninvasive and hotspot aware microchannel die that is in direct fluidic contact with the backside of the microelectronic chip. It also proposes a confinement-wise metric. A thermal resistance of 2.8 °C/W is achieved at a heat flux of 812 W/cm2per heat source, for a total dissipated power of 20 W and a maximum allowed temperature rise of 55 °C. Such performance is obtained with only 19.2 kPa of pressure drop and 9.4 ml/min of flow rate, corresponding to a hydraulic power of only 3 mW and a coefficient of performance of 6500. In addition, the complete chip stack, including the thinned chip, measures only$660~\mu \text{m}$high. Therefore, backside cooling appears to be a promising compact and low consumption solution for compact electronic applications having confined hotspots.

Fetched live from OpenAlex and de-inverted. Abstracts are not stored in this database: the inverted indexes are 8.6 GB of the frame’s 9.3 GB of text, and the host has 13 GB free.

How this classification was reachedexpand

Full frame machine prediction

Teacher imitation

Not calibrated prevalence, not ground truth. Human validation pending. The Gemma side is a direct model label for every work in the frame, read from the title-only record. The Codex side is a classifier learned from the 10,348 direct Codex labels and calibrated to design-weighted sample rates; fields without enough sample support carry no Codex call. Candidate is the union of the two sides; consensus is their intersection. These outputs are machine_predicted_unvalidated and are not human labels.

metaresearch head score (Codex)0.000
metaresearch head score (Gemma)0.000
Version: metacan-v3-hybrid-931329e0061cValidation status: machine_predicted_unvalidated
Candidate categoriesnone
Consensus categoriesnone
DomainCandidate signal: none · Consensus signal: none
Study designCandidate signal: Bench or experimental · Consensus signal: Bench or experimental
GenreCandidate signal: Empirical · Consensus signal: Empirical
Teacher disagreement score0.002
Threshold uncertainty score0.006

Distilled classifier scores by category (both heads)

CategoryCodexGemma
Metaresearch0.0000.000
Meta-epidemiology (narrow)0.0000.000
Meta-epidemiology (broad)0.0000.000
Bibliometrics0.0000.000
Science and technology studies0.0000.000
Scholarly communication0.0000.001
Open science0.0010.000
Research integrity0.0000.000
Insufficient payload (model declined to judge)0.0020.000

Machine scores (provisional)

The two teacher heads of the student model, read on this work. A score orders the frame for review; it never asserts a category, and the validation status ships verbatim with every row.

Baseline scores from an immature model (maturity gate not passed, 7 training rounds). Scores rank; they never assert a category.

Opus teacher head0.012
GPT teacher head0.227
Teacher spread0.216 · how far apart the two teachers sit on this one work
Validation statusscore_only:v0-immature-baseline · verbatim from the scoring run: score_only means the number may rank works, and no category label ships from it

Classification

machine, unvalidated

Machine predicted; a candidate call from one source (direct Gemma or distilled Codex), not a consensus.

The models applied no category: nothing in the taxonomy fit this work.
Study designBench or experimental
Domainnot available
GenreEmpirical

How this classification was reached, model by model and score by score, is at the end of the page under "How this classification was reached".

Quick stats

Citations7
Published2018
Admission routes2
Has abstractyes

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Same venueIEEE Transactions on Components Packaging and Manufacturing TechnologySame topicHeat Transfer and OptimizationFrench-language works237,207