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Record W3138609293 · doi:10.1109/tcpmt.2021.3065579

A Novel Chip-Join Assembly Using Heterogeneous Sn-Ag Bumps

2021· article· en· W3138609293 on OpenAlexafffund
Abderrahim El Amrani, Etienne Paradis, David Danovitch, Dominique Drouin

Bibliographic record

VenueIEEE Transactions on Components Packaging and Manufacturing Technology · 2021
Typearticle
Languageen
FieldEngineering
TopicElectronic Packaging and Soldering Technologies
Canadian institutionsInstitut interdisciplinaire d'innovation technologiqueUniversité de Sherbrooke
FundersNatural Sciences and Engineering Research Council of Canada
KeywordsElectromigrationMaterials scienceSolderingFlip chipElectroplatingThermal copper pillar bumpFabricationLayer (electronics)Diffusion barrierChipOptoelectronicsComposite materialComputer scienceAdhesive

Abstract

fetched live from OpenAlex

In this article, a flip-chip assembly using a heterogeneous solder bump structure is studied. The metallurgical and shape evolution, from bump fabrication through final assembly, is presented, characterized, and discussed. Aiming for lower residual stress during flip-chip assembly, a sequentially plated bump is fabricated to ensure a ductile low Ag content solder proximate to the fragile chip back end of line (BEOL) layers while providing a separate solder portion with a high Ag content. Such a heterogeneous structure is enabled by the integration of a Ni cap barrier within the sequential electroplating process that serves to prevent Ag diffusion between the two distinct solder portions. The heterogeneous structure is shown to remain intact through the chip join operation, thereby proposing improved BEOL integrity during joint solidification. Further, the cap barrier induces a unique, pillar-like solder structure that provides the opportunity to optimize fine pitch assembly processes without the use of a stiff Cu-pillar layer. Finally, the cap barrier is shown to successfully break down using an additional reflow after underfill reinforcement, thus homogenizing the structure into a high-Ag content solder to optimize electromigration resistance.

Fetched live from OpenAlex and de-inverted. Abstracts are not stored in this database: the inverted indexes are 8.6 GB of the frame’s 9.3 GB of text, and the host has 13 GB free.

How this classification was reachedexpand

Full frame machine prediction

Teacher imitation

Not calibrated prevalence, not ground truth. Human validation pending. The Gemma side is a direct model label for every work in the frame, read from the title-only record. The Codex side is a classifier learned from the 10,348 direct Codex labels and calibrated to design-weighted sample rates; fields without enough sample support carry no Codex call. Candidate is the union of the two sides; consensus is their intersection. These outputs are machine_predicted_unvalidated and are not human labels.

metaresearch head score (Codex)0.000
metaresearch head score (Gemma)0.000
Version: metacan-v3-hybrid-931329e0061cValidation status: machine_predicted_unvalidated
Candidate categoriesnone
Consensus categoriesnone
DomainCandidate signal: none · Consensus signal: none
Study designCandidate signal: Bench or experimental · Consensus signal: Bench or experimental
GenreCandidate signal: Empirical · Consensus signal: Empirical
Teacher disagreement score0.001
Threshold uncertainty score0.003

Distilled classifier scores by category (both heads)

CategoryCodexGemma
Metaresearch0.0000.000
Meta-epidemiology (narrow)0.0010.000
Meta-epidemiology (broad)0.0000.000
Bibliometrics0.0000.000
Science and technology studies0.0000.000
Scholarly communication0.0000.001
Open science0.0010.000
Research integrity0.0000.000
Insufficient payload (model declined to judge)0.0010.001

Machine scores (provisional)

The two teacher heads of the student model, read on this work. A score orders the frame for review; it never asserts a category, and the validation status ships verbatim with every row.

Baseline scores from an immature model (maturity gate not passed, 7 training rounds). Scores rank; they never assert a category.

Opus teacher head0.022
GPT teacher head0.232
Teacher spread0.209 · how far apart the two teachers sit on this one work
Validation statusscore_only:v0-immature-baseline · verbatim from the scoring run: score_only means the number may rank works, and no category label ships from it

Classification

machine, unvalidated

Machine predicted; a candidate call from one source (direct Gemma or distilled Codex), not a consensus.

The models applied no category: nothing in the taxonomy fit this work.
Study designBench or experimental
Domainnot available
GenreEmpirical

How this classification was reached, model by model and score by score, is at the end of the page under "How this classification was reached".

Quick stats

Citations3
Published2021
Admission routes2
Has abstractyes

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Same venueIEEE Transactions on Components Packaging and Manufacturing TechnologySame topicElectronic Packaging and Soldering TechnologiesFrench-language works237,207