Influence of Epoxy/Nanosilica on Mechanical Performance of Hemp/Kevlar Fiber Reinforced Hybrid Composite with an Ultrasonic Frequency
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Post-publication record
- Nature
- Retraction
- Reason
- Concerns/Issues about Data;Concerns/Issues about Results and/or Conclusions;Concerns/Issues about Referencing/Attributions;Concerns/Issues about Peer Review;Investigation by Journal/Publisher;Investigation by Third Party;Paper Mill;Computer-Aided Content or Computer-Generated Content;Unreliable Results and/or Conclusions;
- Date
- 12/20/2023 0:00
- Flagged by OpenAlex?
- Yes
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Abstract
Ultrasonic vibration was employed in blending the nanosilica into epoxy resin to manufacture hemp/kevlar/nanosilica-based epoxy composites, with an ultrasonic occurrence of 20 kHz and a 900 W capacity of power. An ultrasonic probe was utilized to ensure the consistent dispersion of the nanoparticles in the epoxy. The mechanical characteristics of hemp/kevlar fiber reinforced with epoxy/nanosilica in a mat form have been studied. Hand layup procedures were used to create these composites, including varying weight % of nanosilica and variable fiber stacking sequencing. The different weight % are 3, 6, and 9, and the stacking sequences are B, C, and D. The effectiveness of ultrasonic irradiation on mechanical characteristics was investigated and related. The inclusion of 6 wt.% of SiO 2 to the B type resulted in a 25% rise in tension and a 37% in bending. The addition of 6 wt.% silica to the C-type hybridization nanocomposite results in a 34% rise in tension and a 38% rise in bending. Extreme tension behavior is attained at 6 wt.% SiO 2 with epoxy with the B type piling order, and extreme bending behavior is obtained at 6 wt.% SiO 2 with the C type piling order. A B-type model composite with a 6-wt.% SiO 2 addition performed better in hygroscopic than A, C, and D type model composites. An SEM is utilized to observe the microstructure of shattered materials.
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The record
- Venue
- Adsorption Science & Technology
- Topic
- Natural Fiber Reinforced Composites
- Field
- Materials Science
- Canadian institutions
- Microsemi (Canada)
- Funders
- —
- Keywords
- KevlarEpoxyComposite materialComposite numberUltrasonic sensorFiberChemistryMaterials scienceAcoustics
- Has abstract in OpenAlex
- yes