Analytical Solutions for Transient Thermal Spreading Resistance of a 3-D Flux Channel
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Bibliographic record
Abstract
In microelectronic devices, the moment a high-power current is transmitted into the system, heat is simultaneously generated, and the thermal field keeps developing until it reaches a steady-state field after a period of time. In this work, transient analytical solutions for the temperature field and thermal resistance of a rectangular 3-D flux channel are obtained. The flux channel is assumed to have a small heat source on the top surface, whereas convective effects are considered on the bottom surface and lateral edges. The time-dependent solutions are presented explicitly as infinite Fourier series forms. In addition, the solutions are also presented in dimensionless forms as generalized solutions. Moreover, an existing, well-established simple model that represents the profile of the transient thermal spreading resistance for a semi-infinite flux tube is used to verify the presented forms of the analytical solutions, and the results compare very well when considering a flux channel of large thickness. Further, the solutions are used to study the behavior of temperature and thermal resistance over time for some dimensional and nondimensional problems.
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| Category | Codex | Gemma |
|---|---|---|
| Metaresearch | 0.000 | 0.000 |
| Meta-epidemiology (narrow) | 0.000 | 0.000 |
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| Bibliometrics | 0.001 | 0.000 |
| Science and technology studies | 0.000 | 0.000 |
| Scholarly communication | 0.000 | 0.000 |
| Open science | 0.000 | 0.000 |
| Research integrity | 0.000 | 0.000 |
| Insufficient payload (model declined to judge) | 0.000 | 0.000 |
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