Research on the Failure Mechanism of TSV Interconnection Structure in RF Microsystem under Temperature Stress
Bibliographic record
Abstract
In order to analyze the failure mechanisms of electrical transmission characteristics and stress distribution in Through Silicon Via (TSV) interconnection structures, this paper conducted thermal shock (-55° to 150 °) and high-temperature storage (200 ° /300 ° /400 ° ) tests. A finite element model of TSV structure was also established. The electrical characteristics (S21), microstructure, and stress-strain behavior of the TSV were investigated. The failure mechanisms of TSV structure under thermal shock and high-temperature storage conditions were elucidated. By combining microstructural observations, the degradation process of TSV induced by temperature stress was studied. The results indicate that the transmission performance of the TSV structure significantly deteriorated after 50 cycles thermal shock. After 1000 cycles, the maximum attenuation of S21 reached 0.55dB. Microscopic analysis revealed that the insulation layer of the TSV cracked due to thermal shock, leading to reduced insulation between the silicon substrate and copper, as well as signal current leakage into the silicon. Under high-temperature storage, the electrical transmission characteristics of TSV structures exhibited significant differences. By integrating experimental data with simulations, this paper systematically investigates the failure mechanisms of TSV structures under temperature stress, providing valuable references for the reliability evaluation of TSV.
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How this classification was reachedexpand
Full frame distilled prediction
Teacher imitationNot calibrated prevalence, not ground truth. Human validation pending. Learned from the 10,348 direct Codex labels and 10,348 direct Gemma labels. Candidate is the union of thresholded teacher heads; consensus is their intersection. These outputs are machine_predicted_unvalidated and are not human labels or direct frontier model labels.
Codex and Gemma teacher scores by category
| Category | Codex | Gemma |
|---|---|---|
| Metaresearch | 0.000 | 0.000 |
| Meta-epidemiology (narrow) | 0.000 | 0.000 |
| Meta-epidemiology (broad) | 0.000 | 0.000 |
| Bibliometrics | 0.001 | 0.001 |
| Science and technology studies | 0.000 | 0.000 |
| Scholarly communication | 0.000 | 0.000 |
| Open science | 0.000 | 0.000 |
| Research integrity | 0.000 | 0.001 |
| Insufficient payload (model declined to judge) | 0.000 | 0.000 |
Machine scores (provisional)
The two teacher heads of the student model, read on this work. A score orders the frame for review; it never asserts a category, and the validation status ships verbatim with every row.
Baseline scores from an immature model (maturity gate not passed, 7 training rounds). Scores rank; they never assert a category.
score_only:v0-immature-baseline · verbatim from the scoring run: score_only means the number may rank works, and no category label ships from itClassification
machine, unvalidatedMachine predicted; a candidate call from one teacher head, not a consensus.
How this classification was reached, model by model and score by score, is at the end of the page under "How this classification was reached".