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Record W4416876062 · doi:10.37665/smksazh82193

Low Melting Temperature Solder Interconnect Behavior and Thermal Cycling Performance Enhancement Using Edgebond

2020· article· W4416876062 on OpenAlex
Tae-Kyu Lee, Carly Rogan, Gihan Dodanduwa Waduge, Young‐Woo Lee, Edward S. Ibe, Karl I. Loh

Why this work is in the frame

A frame that forgets how it found something cannot be audited. These are the routes that admitted this work.

affAt least one author lists a Canadian institution in the pinned OpenAlex snapshot.

Bibliographic record

VenueSMTA International · 2020
Typearticle
Language
FieldEngineering
TopicElectronic Packaging and Soldering Technologies
Canadian institutionsZymeworks (Canada)
Fundersnot available
KeywordsTemperature cyclingBall grid arraySolderingIsothermal processShear (geology)BrittlenessCreepThermalShear strength (soil)

Abstract

fetched live from OpenAlex

ABSTRACT Low melting temperature solder, which enable a lower temperature assembly process comes with significant benefits to less warpage and lower component defect risk, but counter with an potential inferior thermal cycling performance due to the higher creep rate at elevated temperature environment. Adding to the recent active efforts to improve the thermal cycling performance with maintaining the melting temperature, the degradation mechanism in low melting temperature solder alloys is critical to understand, because the mitigation of the degradation mechanism will provide the key mechanism improving the thermal cycling performance. In this study, a series of ball shear test were performed on Sn-58Bi solder balls with 300μm diameter along with SAC3905 solder balls. To see the solder mechanical stability at elevated temperature, a heating stage was used to provide isothermal temperature during shear testing at 100oC. The maximum shear load and the distance to the peak shear load were measured to see the behavior change at elevated temperature. The shear results show an overall higher shear load value with Sn-58Bi compared to SAC305, and a decrease in ductility with elevated temperature shear. Further isothermal aging at 100oC for 200hours decreased the maximum shear load further and increased the brittle behavior in Sn-58Bi. With the understanding of the Sn-58Bi behavior, 12x12 mm chip array BGA (CABGA) components on 62mil thick boards were thermal cycled from -40ºC to 100ºC with Sn-58Bi based alloys to evaluate the thermal cycling performance. To enhance the thermal cycling performance, an edgebond adhesive was applied. Compared to the characteristic life cycle number of 3327 cycles with Sn-58Bi solder, the full edgebond components do not show any failures up to the test completion at 4050 cycles.

Fetched live from OpenAlex and de-inverted. Abstracts are not stored in this database: the inverted indexes are 8.6 GB of the frame’s 9.3 GB of text, and the host has 13 GB free.

Full frame distilled prediction

Teacher imitation

Not calibrated prevalence, not ground truth. Human validation pending. Learned from the 10,348 direct Codex labels and 10,348 direct Gemma labels. Candidate is the union of thresholded teacher heads; consensus is their intersection. These outputs are machine_predicted_unvalidated and are not human labels or direct frontier model labels.

metaresearch head score (Codex)0.000
metaresearch head score (Gemma)0.000
Version: codex-gemma-dda1882f352aValidation status: machine_predicted_unvalidated
Candidate categoriesMeta-epidemiology (narrow)
Consensus categoriesnone
DomainCandidate signal: none · Consensus signal: none
Study designCandidate signal: Bench or experimental · Consensus signal: none
GenreCandidate signal: Empirical · Consensus signal: Empirical
Teacher disagreement score0.496
Threshold uncertainty score1.000

Codex and Gemma teacher scores by category

CategoryCodexGemma
Metaresearch0.0000.000
Meta-epidemiology (narrow)0.0000.000
Meta-epidemiology (broad)0.0000.000
Bibliometrics0.0000.000
Science and technology studies0.0000.000
Scholarly communication0.0000.000
Open science0.0010.000
Research integrity0.0000.001
Insufficient payload (model declined to judge)0.0000.000

Machine scores (provisional)

The two teacher heads of the student model, read on this work. A score orders the frame for review; it never asserts a category, and the validation status ships verbatim with every row.

Baseline scores from an immature model (maturity gate not passed, 7 training rounds). Scores rank; they never assert a category.

Opus teacher head0.020
GPT teacher head0.246
Teacher spread0.226 · how far apart the two teachers sit on this one work
Validation statusscore_only:v0-immature-baseline · verbatim from the scoring run: score_only means the number may rank works, and no category label ships from it