MétaCan
Menu
Back to cohort
Record W4416876830 · doi:10.37665/smoxqks37099

Lead-Free Vapor Phase Assembly Compatible Materials For A High Performance Smt Daughter Card Connector

2011· article· W4416876830 on OpenAlexaff
Ying Yu, John H. Healey, W. F. Mader, Emanuele Lopergolo, Jing Zhang, Theron Lewis, Venkatesan Gopiesh Khanna, Ruediger Kellmann, Jim Bielick

Bibliographic record

VenueSMTA International · 2011
Typearticle
Language
FieldEngineering
TopicElectronic Packaging and Soldering Technologies
Canadian institutionsIBM (Canada)
Fundersnot available
KeywordsCable glandPrinted circuit boardReliability (semiconductor)MotherboardSolderingIBMCircuit reliabilitySolder pasteProcess (computing)

Abstract

fetched live from OpenAlex

ABSTRACT With the possible future expiration of European Union (EU) Restriction of Hazardous Substances (RoHS) exemptions, allowing the use of leaded solder for the assembly of Server, Storage, and other high performance, high reliability systems, comes the need to establish new lead-free assembly processes. As the conversion to lead-free (LF) printed circuit board assembly (PCBA) processing continues to extend into high performance Server hardware platforms, new challenges have been encountered with high density, high complexity connectors. One such case involves various configurations of an SMT daughter card connector used across mid-range and high-end Server systems. This very dense, large thermal mass connector system creates significant challenges for the SMT assembly process. A basic requirement for transitioning from a leaded to a lead-free SMT solder assembly process is that connector materials be capable of surviving higher temperature exposures. At the same time, these materials must meet electronic signal integrity requirements. Furthermore, connector long-term reliability in the field environment, as simulated by accelerated thermal cycling, must not be compromised. This paper characterizes several material options for an SMT daughter card connector which is exposed to a lead-free vapor phase solder assembly process. The characterization includes base material properties, warpage during reflow, post-assembly inspections and measurements, signal integrity, and thermal fatigue performance.

Fetched live from OpenAlex and de-inverted. Abstracts are not stored in this database: the inverted indexes are 8.6 GB of the frame’s 9.3 GB of text, and the host has 13 GB free.

How this classification was reachedexpand

Full frame machine prediction

Teacher imitation

Not calibrated prevalence, not ground truth. Human validation pending. The Gemma side is a direct model label for every work in the frame, read from the title-only record. The Codex side is a classifier learned from the 10,348 direct Codex labels and calibrated to design-weighted sample rates; fields without enough sample support carry no Codex call. Candidate is the union of the two sides; consensus is their intersection. These outputs are machine_predicted_unvalidated and are not human labels.

metaresearch head score (Codex)0.000
metaresearch head score (Gemma)0.000
Version: metacan-v3-hybrid-931329e0061cValidation status: machine_predicted_unvalidated
Candidate categoriesnone
Consensus categoriesnone
DomainCandidate signal: none · Consensus signal: none
Study designCandidate signal: Bench or experimental · Consensus signal: Bench or experimental
GenreCandidate signal: Empirical · Consensus signal: Empirical
Teacher disagreement score0.002
Threshold uncertainty score0.007

Distilled classifier scores by category (both heads)

CategoryCodexGemma
Metaresearch0.0000.000
Meta-epidemiology (narrow)0.0000.000
Meta-epidemiology (broad)0.0000.000
Bibliometrics0.0010.000
Science and technology studies0.0000.000
Scholarly communication0.0000.000
Open science0.0010.000
Research integrity0.0010.000
Insufficient payload (model declined to judge)0.0020.001

Machine scores (provisional)

The two teacher heads of the student model, read on this work. A score orders the frame for review; it never asserts a category, and the validation status ships verbatim with every row.

Baseline scores from an immature model (maturity gate not passed, 7 training rounds). Scores rank; they never assert a category.

Opus teacher head0.042
GPT teacher head0.268
Teacher spread0.226 · how far apart the two teachers sit on this one work
Validation statusscore_only:v0-immature-baseline · verbatim from the scoring run: score_only means the number may rank works, and no category label ships from it

Classification

machine, unvalidated

Machine predicted; a candidate call from one source (direct Gemma or distilled Codex), not a consensus.

The models applied no category: nothing in the taxonomy fit this work.
Study designBench or experimental
Domainnot available
GenreEmpirical

How this classification was reached, model by model and score by score, is at the end of the page under "How this classification was reached".

Quick stats

Citations0
Published2011
Admission routes1
Has abstractyes

Explore more

Same venueSMTA InternationalSame topicElectronic Packaging and Soldering TechnologiesFrench-language works237,207