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Record W4416878096 · doi:10.37665/smtjgni36068

A Comparison of Thermal Cycling and Thermal Shock for Evaluating Solder Joint Reliability

2024· article· W4416878096 on OpenAlexaff
Richard Coyle, Dave Hillman, Chloe Feng, Tim Pearson, Michael Osterman, Jayse McLean, Joe Smetana, Keith Howell, Julie Silk, Hongwen Zhang, Jie Geng, Derek Daily, Anna Lifton, Morgana Ribas, Raiyo Aspandiar, Ranjit Pandher, Richard Popowich, James Wertin, Jean-Christophe Riou, Grace O’Malley, Madan Jagernauth, Shantanu Joshi, Jasbir Bath

Bibliographic record

VenueSMTA International · 2024
Typearticle
Language
FieldEngineering
TopicElectronic Packaging and Soldering Technologies
Canadian institutionsSafran Electronics (Canada)Alpha Technologies (Canada)
Fundersnot available
KeywordsBall grid arrayTemperature cyclingSolderingThermal shockEutectic systemFlip chipFailure mode and effects analysisWeibull distributionPower cycling

Abstract

fetched live from OpenAlex

ABSTRACT The industry standard for accelerated temperature cycling, IPC-9701B, defines test conditions for characterizing solder interconnect fatigue. The document specifies a maximum cycling ramp rate of 20 °C/minute to avoid thermal shock conditions that can accelerate failure modes other than low cycle fatigue in the bulk solder. This investigation compares the performance and failure mode of two ball grid array (BGA) packages tested with cyclic ramp rates characteristic of thermal cycling and thermal shock. The accelerated temperature profile is from −40 °C to 125 °C for thermal cycling and thermal shock, with the cycling ramp rates approximately three times faster with thermal shock and with equal dwell times in cycling and shock. The test matrix includes BGA packages fabricated with eutectic SnPb and near-eutectic SAC305 solder alloys as the performance baselines, and three high-performance solder alloys based on the SAC system but modified with additions of bismuth (Bi) and antimony (Sb). The failure data are reported as characteristic lifetime η (the number of cycles to achieve 63.2% failure), slope β, and cumulative 1% failure from a two-parameter Weibull analysis. Destructive cross-sectional analysis was used to characterize the solder microstructures before and after testing and the interconnect failure mode. The results show that the thermal cycling ramp rate and the thermal shock ramp rate produced the same results quantitatively and the same failure modes. These findings apply to the two BGA components in combination with the five solder alloys used in the study. For these test conditions, components, and solder alloys, the same results were achieved in thermal shock compared to thermal cycling with a 30% savings in test duration.

Fetched live from OpenAlex and de-inverted. Abstracts are not stored in this database: the inverted indexes are 8.6 GB of the frame’s 9.3 GB of text, and the host has 13 GB free.

How this classification was reachedexpand

Full frame distilled prediction

Teacher imitation

Not calibrated prevalence, not ground truth. Human validation pending. Learned from the 10,348 direct Codex labels and 10,348 direct Gemma labels. Candidate is the union of thresholded teacher heads; consensus is their intersection. These outputs are machine_predicted_unvalidated and are not human labels or direct frontier model labels.

metaresearch head score (Codex)0.001
metaresearch head score (Gemma)0.000
Version: codex-gemma-dda1882f352aValidation status: machine_predicted_unvalidated
Candidate categoriesMeta-epidemiology (narrow)
Consensus categoriesnone
DomainCandidate signal: none · Consensus signal: none
Study designCandidate signal: Simulation or modeling · Consensus signal: none
GenreCandidate signal: Empirical · Consensus signal: Empirical
Teacher disagreement score0.711
Threshold uncertainty score1.000

Codex and Gemma teacher scores by category

CategoryCodexGemma
Metaresearch0.0010.000
Meta-epidemiology (narrow)0.0000.000
Meta-epidemiology (broad)0.0000.000
Bibliometrics0.0000.000
Science and technology studies0.0000.000
Scholarly communication0.0000.000
Open science0.0000.000
Research integrity0.0000.001
Insufficient payload (model declined to judge)0.0000.000

Machine scores (provisional)

The two teacher heads of the student model, read on this work. A score orders the frame for review; it never asserts a category, and the validation status ships verbatim with every row.

Baseline scores from an immature model (maturity gate not passed, 7 training rounds). Scores rank; they never assert a category.

Opus teacher head0.063
GPT teacher head0.370
Teacher spread0.307 · how far apart the two teachers sit on this one work
Validation statusscore_only:v0-immature-baseline · verbatim from the scoring run: score_only means the number may rank works, and no category label ships from it

Classification

machine, unvalidated

Machine predicted; a candidate call from one teacher head, not a consensus.

Study designSimulation or modeling
Domainnot available
GenreEmpirical

How this classification was reached, model by model and score by score, is at the end of the page under "How this classification was reached".

Quick stats

Citations0
Published2024
Admission routes1
Has abstractyes

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