MétaCan
Menu
Back to cohort
Record W7108216163 · doi:10.37665/jsmtapvhh57901

Strategic Environmental Research and Development Program (SERDP) Tin Whisker Testing and Modeling: Thermal Cycling Testing

2015· article· W7108216163 on OpenAlexaff

Bibliographic record

VenueJournal of Surface Mount Technology · 2015
Typearticle
Language
FieldEngineering
TopicElectronic Packaging and Soldering Technologies
Canadian institutionsHain Celestial (Canada)
Fundersnot available
KeywordsWhiskerTemperature cyclingSolderingTinAccelerated life testingMonocrystalline whiskerThermal shockAerospace

Abstract

fetched live from OpenAlex

ABSTRACT Driven in part by European Union directives, most commercial electronics manufacturers began a global movement away from using lead (Pb). Component manufacturers are increasingly applying tin-rich finishes to the leads of their devices and soldering with lead (Pb)-free solders. Unfortunately, this can create a risk of tin whisker formation that can result in electrical failures. Because of its unique requirements such as long service lifetimes, rugged operating environments, and high consequences of failure, the aerospace and defense industries must mitigate the detrimental effects that tin whiskers. The present paper provides a status on the effort associated with a multi-year testing and modeling program that aims to assess tin whisker growth on lead-free manufactured assemblies and utilizes whisker short circuit statistical modeling to enable improved reliability assessments. The tin whisker growth of tin finished parts soldered with SAC305 (Sn-3.0Ag-0.5Cu) solder alloy under −55 to +85 °C thermal shock cycling conditions in accordance with JESD-201 for over 2000 cycles was evaluated. Significant whisker nucleation and growth from the SAC305 solder alloy occurred where the solder was less than 25 microns thick with alloy 42 lead terminations. Whisker angular rotation during growth was also observed. Several competing stress relaxation mechanisms in addition to whisker growth were found including excessive deformation, volume recrystallization with massive eruptions of the recrystallized grains. This type of microstructure is not typical for most field conditions. Therefore, the JESD-201 −55 to 85 °C three cycles per hour thermal shock profile does not provide an optimal lead-free assembly whisker assessment test. Also, this test causes cracking of harder conformal coatings not observed in service and may not allow whisker mitigation evaluation of certain conformal coatings.

Fetched live from OpenAlex and de-inverted. Abstracts are not stored in this database: the inverted indexes are 8.6 GB of the frame’s 9.3 GB of text, and the host has 13 GB free.

How this classification was reachedexpand

Full frame machine prediction

Teacher imitation

Not calibrated prevalence, not ground truth. Human validation pending. The Gemma side is a direct model label for every work in the frame, read from the title-only record. The Codex side is a classifier learned from the 10,348 direct Codex labels and calibrated to design-weighted sample rates; fields without enough sample support carry no Codex call. Candidate is the union of the two sides; consensus is their intersection. These outputs are machine_predicted_unvalidated and are not human labels.

metaresearch head score (Codex)0.001
metaresearch head score (Gemma)0.001
Version: metacan-v3-hybrid-931329e0061cValidation status: machine_predicted_unvalidated
Candidate categoriesnone
Consensus categoriesnone
DomainCandidate signal: none · Consensus signal: none
Study designCandidate signal: Bench or experimental · Consensus signal: none
GenreCandidate signal: Empirical · Consensus signal: none
Teacher disagreement score0.020
Threshold uncertainty score0.040

Distilled classifier scores by category (both heads)

CategoryCodexGemma
Metaresearch0.0010.001
Meta-epidemiology (narrow)0.0000.000
Meta-epidemiology (broad)0.0000.000
Bibliometrics0.0010.001
Science and technology studies0.0000.000
Scholarly communication0.0010.000
Open science0.0010.000
Research integrity0.0000.000
Insufficient payload (model declined to judge)0.0030.001

Machine scores (provisional)

The two teacher heads of the student model, read on this work. A score orders the frame for review; it never asserts a category, and the validation status ships verbatim with every row.

Baseline scores from an immature model (maturity gate not passed, 7 training rounds). Scores rank; they never assert a category.

Opus teacher head0.206
GPT teacher head0.327
Teacher spread0.121 · how far apart the two teachers sit on this one work
Validation statusscore_only:v0-immature-baseline · verbatim from the scoring run: score_only means the number may rank works, and no category label ships from it

Classification

machine, unvalidated

Machine predicted; a candidate call from one source (direct Gemma or distilled Codex), not a consensus.

The models applied no category: nothing in the taxonomy fit this work.
Study designBench or experimental
Domainnot available
GenreEmpirical

How this classification was reached, model by model and score by score, is at the end of the page under "How this classification was reached".

Quick stats

Citations0
Published2015
Admission routes1
Has abstractyes

Explore more

Same venueJournal of Surface Mount TechnologySame topicElectronic Packaging and Soldering TechnologiesFrench-language works237,207