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Record W7108220634 · doi:10.37665/smarkbe94437

Via-in-Pad Design Considerations for Bottom Terminated Components on Printed Circuit Board Assemblies

2014· article· W7108220634 on OpenAlex

Why this work is in the frame

A frame that forgets how it found something cannot be audited. These are the routes that admitted this work.

affAt least one author lists a Canadian institution in the pinned OpenAlex snapshot.

Bibliographic record

VenueSMTA International · 2014
Typearticle
Language
FieldEngineering
TopicElectronic Packaging and Soldering Technologies
Canadian institutionsIBM (Canada)
Fundersnot available
KeywordsReworkPrinted circuit boardFootprintSurface-mount technologyQuad Flat No-leads packageDesign for manufacturabilityComponent (thermodynamics)SolderingElectronic componentReliability (semiconductor)

Abstract

fetched live from OpenAlex

ABSTRACT Over the last two years, there has been a substantial increase in the usage of bottom terminated components (BTCs) within high complexity, high-reliability Server and Storage class hardware products. Component suppliers are offering a greater variety of small form factor BTCs as QFNs integrating thermal pads and thermal vias. Designers are readily adopting these packages. With their small component body footprint and minimal PCB area requirements, physical designers are keen to incorporate small footprint QFN solutions within circuit designs to meet a wide variety of voltage/power regulation, logic controller, and clocking needs. To date, the majority of published work relating to QFNs with thermal pads utilize via structures that are either open or filled. In the case of open via structure designs, solder intended for the thermal pad can travel down thermal vias robbing the pad structure of desired solder volume leading to inconsistent component standoff/reliability, I/O opens, increased rework difficulties, and underside solder shards – with longer-term system level shorting risks. Alternatively, filled thermal via design points, ensure a planar surface is created upon which to solder the component to the thermal pad. Solder mask ‘via tenting’, encroached vias, and costly via in pad plated over (VIPPO) techniques are widely used across the industry to achieve this. While many of these options may be suitable for some electronic hardware products – manufacturability trade-offs, reliability, and cost impacts may limit usage in some high complexity, high reliability applications. This paper introduces a new alternative using QFNs with open thermal via-in-pad (VIP) structures. The design point discussed utilizes conventional PCB through-hole via technology that is not plugged nor filled in any manner, ensures proper via sizes/pitch/counts/locations are achieved, and incorporates custom solder mask window patterns overtop copper thermal pad areas. The solution enables a lower cost PCB compared to VIPPO structures, eliminates the possibility of solder wicking down via structures, and significantly improves component assembly/reworkablity. In addition, it helps maximize thermal, power, and interconnect reliability of QFN packages. Results from fourteen months of development and optimization are included. The importance of designing for thermal, power, and signal integrity considerations are discussed. Manufacturing quality and reworkability are also of key interest. The intent of the paper is to offer a new design solution as an option to published methods.

Fetched live from OpenAlex and de-inverted. Abstracts are not stored in this database: the inverted indexes are 8.6 GB of the frame’s 9.3 GB of text, and the host has 13 GB free.

Full frame distilled prediction

Teacher imitation

Not calibrated prevalence, not ground truth. Human validation pending. Learned from the 10,348 direct Codex labels and 10,348 direct Gemma labels. Candidate is the union of thresholded teacher heads; consensus is their intersection. These outputs are machine_predicted_unvalidated and are not human labels or direct frontier model labels.

metaresearch head score (Codex)0.001
metaresearch head score (Gemma)0.001
Version: codex-gemma-dda1882f352aValidation status: machine_predicted_unvalidated
Candidate categoriesMeta-epidemiology (narrow)
Consensus categoriesnone
DomainCandidate signal: none · Consensus signal: none
Study designCandidate signal: Simulation or modeling · Consensus signal: none
GenreCandidate signal: Empirical · Consensus signal: none
Teacher disagreement score0.696
Threshold uncertainty score1.000

Codex and Gemma teacher scores by category

CategoryCodexGemma
Metaresearch0.0010.001
Meta-epidemiology (narrow)0.0000.000
Meta-epidemiology (broad)0.0000.000
Bibliometrics0.0010.000
Science and technology studies0.0000.000
Scholarly communication0.0000.000
Open science0.0010.000
Research integrity0.0000.001
Insufficient payload (model declined to judge)0.0000.000

Machine scores (provisional)

The two teacher heads of the student model, read on this work. A score orders the frame for review; it never asserts a category, and the validation status ships verbatim with every row.

Baseline scores from an immature model (maturity gate not passed, 7 training rounds). Scores rank; they never assert a category.

Opus teacher head0.051
GPT teacher head0.272
Teacher spread0.221 · how far apart the two teachers sit on this one work
Validation statusscore_only:v0-immature-baseline · verbatim from the scoring run: score_only means the number may rank works, and no category label ships from it