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Record W4416877975 · doi:10.37665/smgvlzz35389

Converting High Volume IC Manufacturing to CU Wire Packaging

2013· article· W4416877975 on OpenAlexaff
Larry Bright

Bibliographic record

VenueSMTA International · 2013
Typearticle
Language
FieldEngineering
TopicElectronic Packaging and Soldering Technologies
Canadian institutionsMicrosemi (Canada)
Fundersnot available
KeywordsWire bondingOriginal equipment manufacturerIntegrated circuit packagingLead frameReliability (semiconductor)Electronic packagingManufacturing costDie (integrated circuit)Integrated circuitWafer

Abstract

fetched live from OpenAlex

ABSTRACT Converting integrated circuit (IC) bills of material (BOMs) from gold (Au) to copper (Cu) wire is becoming mainstream in semiconductor manufacturing. With the price of gold skyrocketing, cost is the primary driver for conversion. Although there are other advantages that complement the huge cost savings, few contract manufactures and Original Equipment Manufacturers (OEMs) are excited about these enhanced properties. Instead, they are most concerned with manufacturing controls, interaction with current BOMs, and the long-term reliability of Cu-wire in IC packaging. The benefits and concerns of using copper wire versus traditional gold wire BOMs are explored and various customer concerns are discussed. A myriad of evaluations were designed to determine the impact of the Cu-wire bonding across various wafer and package technologies. This laid the groundwork for a significant ramp into production. However, market acceptance needed to be considered as well, particularly from the OEM and Electronic Manufacturing Services (EMS) point of view. There are subtle benefits, such as improved electrical and thermal properties as well as slower intermetallic growth as summarized in Figure 1 above, but the primary risks are what customers tend to focus on. These include oxidation and increased hardness of the wire itself, interactions with impurities in various mold compounds, and controlling the manufacturing process over time. Initially traditional gold-wire bonders were retrofitted with conversions kits to allow the use of copper wire during the IC manufacturing bonding process. As more was learned about Cu-wire bonding, new bonding equipment was specifically designed to accommodate the unique requirements of using copper wire. The introduction of forming gas, capillary design, and other factors will be discussed as key parameters are optimized during the characterization of the copper-wire bond recipe. The definition of a “good bond”, revised process controls, extended reliability studies, and a look into what’s next wrap up the discussion.

Fetched live from OpenAlex and de-inverted. Abstracts are not stored in this database: the inverted indexes are 8.6 GB of the frame’s 9.3 GB of text, and the host has 13 GB free.

How this classification was reachedexpand

Full frame machine prediction

Teacher imitation

Not calibrated prevalence, not ground truth. Human validation pending. The Gemma side is a direct model label for every work in the frame, read from the title-only record. The Codex side is a classifier learned from the 10,348 direct Codex labels and calibrated to design-weighted sample rates; fields without enough sample support carry no Codex call. Candidate is the union of the two sides; consensus is their intersection. These outputs are machine_predicted_unvalidated and are not human labels.

metaresearch head score (Codex)0.001
metaresearch head score (Gemma)0.001
Version: metacan-v3-hybrid-931329e0061cValidation status: machine_predicted_unvalidated
Candidate categoriesnone
Consensus categoriesnone
DomainCandidate signal: none · Consensus signal: none
Study designCandidate signal: Not applicable · Consensus signal: none
GenreCandidate signal: Methods · Consensus signal: Methods
Teacher disagreement score0.007
Threshold uncertainty score0.022

Distilled classifier scores by category (both heads)

CategoryCodexGemma
Metaresearch0.0010.001
Meta-epidemiology (narrow)0.0010.000
Meta-epidemiology (broad)0.0000.001
Bibliometrics0.0010.001
Science and technology studies0.0000.000
Scholarly communication0.0020.001
Open science0.0010.001
Research integrity0.0010.001
Insufficient payload (model declined to judge)0.0070.003

Machine scores (provisional)

The two teacher heads of the student model, read on this work. A score orders the frame for review; it never asserts a category, and the validation status ships verbatim with every row.

Baseline scores from an immature model (maturity gate not passed, 7 training rounds). Scores rank; they never assert a category.

Opus teacher head0.007
GPT teacher head0.210
Teacher spread0.203 · how far apart the two teachers sit on this one work
Validation statusscore_only:v0-immature-baseline · verbatim from the scoring run: score_only means the number may rank works, and no category label ships from it

Classification

machine, unvalidated

Machine predicted; a candidate call from one source (direct Gemma or distilled Codex), not a consensus.

The models applied no category: nothing in the taxonomy fit this work.
Study designNot applicable
Domainnot available
GenreMethods

How this classification was reached, model by model and score by score, is at the end of the page under "How this classification was reached".

Quick stats

Citations0
Published2013
Admission routes1
Has abstractyes

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