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4,299,418 works, Canadian by any of four routes.

Every filter state is a URL; the URL is the query; the query is citable via /q/⟨hash⟩. The page, the API and the export parse the same parameters.

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The current cohort, streamed from the database: every work column, the machine labels, the provisional scores, and the per-row validation status. Exports are capped at 100,000 rows. Mints a permanent /q/ link for this exact query. The same filters always produce the same link, whoever asks.

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3D IC and TSV technologies
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Direct Codex and Gemma labels are unvalidated and sparse. Distilled predictions cover the full frame and are also unvalidated. Choose the evidence source explicitly; absence of a direct label is never a negative label.

affaffiliation
fundfunder
venuejournal
aboutaboutness

The four routes compose: require the funder route and exclude affiliation to get the funder-only stratum no affiliation-based frame ever sees.

238 results · 1 filter active ·
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20002025
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Machine labels · sparse coverage
Evidence
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An unlabeled work is unknown, not a negative. Label coverage is reported on every query.
238 works in the cohort · of 4,299,418page 4 of 5

Labels cover 0 of 238 works in this cohort. The rest are unlabeled, which is not a negative label: the label table is sparse today and grows as labeling rounds land.

Distilled predictions cover 238 of 238 works in this cohort. Predictions are machine_predicted_unvalidated teacher distillation outputs. Candidate is the union; consensus is the intersection.

affunlabeled
Keeping hot chips cool
Ruchir Puri, Devadas Varma, Darvin Edwards, Alan J. Weger, Paul D. Franzon, Andrew T. Yang +1 more
2008· article· en· Engineering
distilled prediction:candidate · noneconsensus · none
1
citations
affunlabeled
Load pull characterization
C. Tsironis, T. Williams
2019· book-chapter· en· Institution of Engineering and Technology eBooks· Engineering
distilled prediction:candidate · metaepi_narrowconsensus · none
1
citations
affno abstractunlabeled
Packaging (and Wire Bonding)
Mu Chiao
2014· book-chapter· en· Engineering
distilled prediction:candidate · noneconsensus · none
0
citations
affunlabeled
A Novel Approach To 3D Chip Stacking
Sukhi Binapal, Ron Csermak, Mark Vandermeulen
2012· article· Soldering and Reliability Conferences· Engineering
distilled prediction:candidate · metaepi_narrowconsensus · none
0
citations
fundno affunlabeled
SRAM in Three Dimensional Integrated Circuits
Negin Golshani
2009· article· en· Research Repository (Delft University of Technology)· Engineering
distilled prediction:candidate · noneconsensus · none
0
citations
affno abstractunlabeled
MUSiC® Process
Robert W. Johnstone, M. Parameswaran
2004· book-chapter· en· Engineering
distilled prediction:candidate · insufficient_payloadconsensus · none
0
citations
affno abstractunlabeled
Packaging
Behraad Bahreyni
2009· book-chapter· en· Elsevier eBooks· Engineering
distilled prediction:candidate · metaepi_narrowconsensus · none
0
citations
affunlabeled
3D Digital SiPM and Smart Silicon Interposer for nEXO
Sa Charlebois, F Bourque, P Momar Souare, F Nolet, T Dequivre, E Al Alam +5 more
2016· preprint· en· HAL (Le Centre pour la Communication Scientifique Directe)· Engineering
distilled prediction:candidate · metaepi_narrowconsensus · none
0
citations
affno abstractunlabeled
RF Coils for Microimaging
K Jasiński, W.W. Weglarz, Bogusław Tomanek
2011· article· en· Engineering
distilled prediction:candidate · noneconsensus · none
0
citations
affunlabeled
Entering the hot zone
Amy Yang, Stephen Burke, J. A. DeLaCruz, S. Santhanam, U. Ko
2006· article· en· Engineering
distilled prediction:candidate · noneconsensus · none
0
citations
aboutno affunlabeled
Characterization of Interconnects
Peter Hacke
2023· paratext· en· OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information)· Engineering
distilled prediction:candidate · noneconsensus · none
0
citations
affunlabeled
A Novel Approach to 3D Chip Stacking
Mark Vandermeulen, Andrew D. Smith, Ron Csermak
2011· article· en· Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)· Engineering
distilled prediction:candidate · metaepi_narrow+insufficient_payloadconsensus · none
0
citations
affunlabeled
Metal-assisted hermetic wafer-level packaging
Dany Chagnon, Dilek Işık, Pierre L. Lévesque, François Lewis, Marie-Ève Caza, Xuan Tuan Le +4 more
2014· article· en· Engineering
distilled prediction:candidate · noneconsensus · none
0
citations
affno abstractunlabeled
3D Interconnect Simulation
Simon Li, Yue Fu
2011· book-chapter· en· Engineering
distilled prediction:candidate · insufficient_payloadconsensus · insufficient_payload
0
citations
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