MétaCan
Menu
Cohort builder

4,299,418 works, Canadian by any of four routes.

Every filter state is a URL; the URL is the query; the query is citable via /q/⟨hash⟩. The page, the API and the export parse the same parameters.

The current cohort, streamed from the database: every work column, the machine labels, the provisional scores, and the per-row validation status. Exports are capped at 100,000 rows. Mints a permanent /q/ link for this exact query. The same filters always produce the same link, whoever asks.

Search term
Author
Year range
Sort
Language
Type
Field
Venue
Topic
3D IC and TSV technologies
Retraction
Abstract
Evidence source
Study design
Label agreement
Label status

Direct Codex and Gemma labels are unvalidated and sparse. Distilled predictions cover the full frame and are also unvalidated. Choose the evidence source explicitly; absence of a direct label is never a negative label.

affaffiliation
fundfunder
venuejournal
aboutaboutness

The four routes compose: require the funder route and exclude affiliation to get the funder-only stratum no affiliation-based frame ever sees.

238 results · 1 filter active ·
Results by year
20002025
Publication date
Categories
Machine labels · sparse coverage
Evidence
Language
Type
Citations
An unlabeled work is unknown, not a negative. Label coverage is reported on every query.
238 works in the cohort · of 4,299,418page 3 of 5

Labels cover 0 of 238 works in this cohort. The rest are unlabeled, which is not a negative label: the label table is sparse today and grows as labeling rounds land.

Distilled predictions cover 238 of 238 works in this cohort. Predictions are machine_predicted_unvalidated. The Gemma side is a direct model label for every work (title-only); the Codex side is a distilled, calibrated classifier. Candidate is the union; consensus is the intersection.

affunlabeled
Temporary Bonding Technologies for Thin Wafer Handling
Prantik Mazumder, Robert A. Bellman, Robert G. Manley, Indrani Bhattacharyya, Kaveh Adib
2018· article· en· ECS Meeting Abstracts· Engineering
machine prediction:candidate · noneconsensus · none
3
citations
afffundunlabeled
69‐4: Active Backplane Design for Digital Video Walls
D. R. Dykaar, Roohollah Samadzadeh Tarighat, Feng Chen, Tyler Davidson‐Hall, G.N. Hill, John Vieth +3 more
2017· article· en· SID Symposium Digest of Technical Papers· Engineering
machine prediction:candidate · noneconsensus · none
2
citations
affunlabeled
Packaging Renaissance with Chiplets
Milind Bhagavat
2019· article· en· IMAPSource Proceedings· Engineering
machine prediction:candidate · noneconsensus · none
2
citations
affno abstractunlabeled
Microfabrication Processes
Robert W. Johnstone, M. Parameswaran
2004· book-chapter· en· Engineering
machine prediction:candidate · noneconsensus · none
2
citations
afffundunlabeled
Exploring Ru Compatibility With Al-Ge Eutectic Wafer Bonding
Mark W. J. Ferguson, Mohamed Najah, Frederic A. Banville, Mohamed Boucherit, Paul Gond-Charton, Jacques Renaud +4 more
2022· article· en· Journal of Microelectromechanical Systems· Engineering
machine prediction:candidate · noneconsensus · none
1
citations
affunlabeled
SiP and Module
R. Aschenbrenner, K. Pressel, Andreas Erhard Graßmann
2019· article· en· IMAPSource Proceedings· Engineering
machine prediction:candidate · noneconsensus · none
1
citations
affunlabeled
3-D Chip Integration Technology for Microsystems
Alexander Kaiser, A. Munding, P. Benkart, M. Bschorr, Arne Heittmann, Holger Huebner +3 more
2006· article· en· ECS Meeting Abstracts· Engineering
machine prediction:candidate · noneconsensus · none
1
citations
affunlabeled
F4: Paving the Way to 200Gb/s Transceivers
Mike Li, San José, C. Patrick Yue, Sudip Shekhar, Thomas Toifl, Bo Zhang +3 more
2022· article· en· 2022 IEEE International Solid- State Circuits Conference (ISSCC)· Engineering
machine prediction:candidate · noneconsensus · none
1
citations
affunlabeled
Full-wafer thermal imaging in ultrahigh epitaxy tools
Bernard Paquette, André Fekecs, Badii Gsib, Hubert Pelletier, Richard Arès
2010· article· en· Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE· Engineering
machine prediction:candidate · noneconsensus · none
1
citations
affunlabeled
Process and Equipment for eWLB
Edward Fürgut, Hirohito Oshimori, Hiroaki Yamagishi
2019· other· en· Engineering
machine prediction:candidate · noneconsensus · none
1
citations
afffundunlabeled
A Novel Method for Bonding of Ionic Wafers
M.R. Howalder, Tadatomo Suga, M.J. Kim, Naoki Itoh, M. Jamal Deen, Peter Mascher
2006· article· en· Engineering
machine prediction:candidate · noneconsensus · none
1
citations

How this was built: Screen · Findings · About